The SEMICONDUCTOR DEVICE,DIODE is a the manufacturer industrial component. Key specifications include material: GLASS ENCLOSURE, overall_length: 0.140 INCHES MINIMUM AND 0.180 INCHES MAXIMUM IN, mounting_method: TERMINAL, terminal_length: 1.000 INCHES MINIMUM AND 1.500 INCHES MAXIMUM IN, overall_diameter: 0.056 INCHES MINIMUM AND 0.075 INCHES MAXIMUM IN, special_features: DIODE. This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5961-00-018-1217, indicating validated use in U.S.
government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels. Verify compatibility with your specific system configuration before ordering.
| material | GLASS ENCLOSURE |
| overall_length | 0.140 INCHES MINIMUM AND 0.180 INCHES MAXIMUM IN |
| mounting_method | TERMINAL |
| terminal_length | 1.000 INCHES MINIMUM AND 1.500 INCHES MAXIMUM IN |
| overall_diameter | 0.056 INCHES MINIMUM AND 0.075 INCHES MAXIMUM IN |
| special_features | DIODE |
| features_provided | GOLD PLATED LEADS |
| precious_material | GOLD |
| end_item_identification | AN/BQQ10 (V) 4UN3750 TI08, TSMS/NSSN FWD CAB |
| terminal_circle_diameter | 0.056 INCHES MINIMUM AND 0.075 INCHES MAXIMUM IN |
| terminal_type_and_quantity | 2 UNINSULATED WIRE LEAD |
| precious_material_and_location | BACK (CATHODE) GOLD |
| NSN | 5961-00-018-1217 |
| FEATURES PROVIDED | HERMETICALLY SEALED CASE |
| MATERIAL | GLASS ENCLOSURE |
| MATERIAL | SILICON SEMICONDUCTOR |