The SEMICONDUCTOR DEVICE,DIODE is a the manufacturer industrial component. Key specifications include material: GLASS ENCLOSURE, overall_length: 0.324 INCHES MINIMUM AND 0.410 INCHES MAXIMUM IN, mounting_method: TERMINAL, terminal_length: 0.180 INCHES MINIMUM AND 0.190 INCHES MAXIMUM IN, overall_diameter: 0.246 INCHES MINIMUM AND 0.250 INCHES MAXIMUM IN, special_features: 9375.0 MHZ TEST FREQRENCY MHz. This part is cataloged in the Federal Logistics Information System under NSN 5961-00-633-5906, indicating validated use in U.S.
government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels. Verify compatibility with your specific system configuration before ordering.
| material | GLASS ENCLOSURE |
| overall_length | 0.324 INCHES MINIMUM AND 0.410 INCHES MAXIMUM IN |
| mounting_method | TERMINAL |
| terminal_length | 0.180 INCHES MINIMUM AND 0.190 INCHES MAXIMUM IN |
| overall_diameter | 0.246 INCHES MINIMUM AND 0.250 INCHES MAXIMUM IN |
| special_features | 9375.0 MHZ TEST FREQRENCY MHz |
| features_provided | HERMETICALLY SEALED CASE |
| precious_material | GOLD |
| terminal_type_and_quantity | 2 PIN |
| specification/standard_data | 81349-MIL-S-19500/322 GOVERNMENT SPECIFICATION |
| precious_material_and_location | BODY SURFACE GOLD |
| power_rating_per_characteristic | 20.0 WATTS MAXIMUM TOTAL POWER DISSIPATION |
| NSN | 5961-00-633-5906 |
| SPECIFICATION/STANDARD DATA | 80131-RELEASE2075 PROFESSIONAL/INDUSTRIAL ASSOCIATION SPECIFICATION |
| TERMINAL TYPE AND QUANTITY | 1 TURRET AND 1 SOLDER STUD |
| MATERIAL | SILICON SEMICONDUCTOR |
| FEATURES PROVIDED | HERMETICALLY SEALED CASE |
| OVERALL LENGTH | 0.650 INCHES NOMINAL IN |
| OVERALL DIAMETER | 0.296 INCHES NOMINAL IN |
| MOUNTING METHOD | TERMINAL |
| TERMINAL LENGTH | 0.180 INCHES MINIMUM IN |
| MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 150.0 CELSIUS AMBIENT AIR DEGC |