The SEMICONDUCTOR DEVICE,DIODE is a the manufacturer industrial component. Key specifications include material: SILICON SEMICONDUCTOR, overall_length: 0.315 INCHES MAXIMUM IN, mounting_method: THREADED STUD(S), overall_diameter: 0.265 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED CASE, nominal_thread_size: 0.112 INCHES IN. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5961-00-809-2142, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| material | SILICON SEMICONDUCTOR |
| overall_length | 0.315 INCHES MAXIMUM IN |
| mounting_method | THREADED STUD(S) |
| overall_diameter | 0.265 INCHES MAXIMUM IN |
| features_provided | HERMETICALLY SEALED CASE |
| nominal_thread_size | 0.112 INCHES IN |
| thread_series_designator | UNIFIED NATIONAL COARSE (UNC) |
| mounting_facility_quantity | 1 |
| terminal_type_and_quantity | 1 TAB, SOLDER LUG AND 1 THREADED STUD |
| power_rating_per_characteristic | 10.0 WATTS MAXIMUM TOTAL POWER DISSIPATION |
| current_rating_per_characteristic | 25.00 MILLIAMPERES MAXIMUM MAXIMUM REVERSE SURGE CURRENT |
| voltage_rating_in_volts_per_characteristic | 8.2 MAXIMUM NOMINAL REGULATOR VOLTAGE |
| NSN | 5961-00-809-2142 |
| MATERIAL | SILICON SEMICONDUCTOR |
| FEATURES PROVIDED | HERMETICALLY SEALED CASE |
| MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 200.0 CELSIUS AMBIENT AIR DEGC |
| OVERALL LENGTH | 0.315 INCHES MAXIMUM IN |
| MOUNTING FACILITY QUANTITY | 1 |
| MOUNTING METHOD | THREADED STUD(S) |
| OVERALL DIAMETER | 0.265 INCHES MAXIMUM IN |
| NOMINAL THREAD SIZE | 0.112 INCHES IN |
| CURRENT RATING PER CHARACTERISTIC | 25.00 MILLIAMPERES MAXIMUM MAXIMUM REVERSE SURGE CURRENT |
| POWER RATING PER CHARACTERISTIC | 10.0 WATTS MAXIMUM TOTAL POWER DISSIPATION |