The SEMICONDUCTOR DEVICE,DIODE is a the manufacturer industrial component. Key specifications include material: SILICON SEMICONDUCTOR, overall_length: 1.253 INCHES MAXIMUM IN, mounting_method: THREADED STUD(S), features_provided: HERMETICALLY SEALED CASE, nominal_thread_size: 0.190 INCHES IN, thread_series_designator: UNF. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5961-00-681-9880, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| material | SILICON SEMICONDUCTOR |
| overall_length | 1.253 INCHES MAXIMUM IN |
| mounting_method | THREADED STUD(S) |
| features_provided | HERMETICALLY SEALED CASE |
| nominal_thread_size | 0.190 INCHES IN |
| thread_series_designator | UNF |
| mounting_facility_quantity | 1 |
| overall_width_across_flats | 0.424 INCHES MINIMUM AND 0.437 INCHES MAXIMUM IN |
| terminal_type_and_quantity | 1 TAB, SOLDER LUG AND 1 THREADED STUD |
| nondefinitive_spec/std_data | 1N1200 TYPE |
| specification/standard_data | 81349-MIL-S-19500/260 GOVERNMENT SPECIFICATION |
| power_rating_per_characteristic | 18.0 WATTS MAXIMUM TOTAL POWER DISSIPATION |
| NSN | 5961-00-681-9880 |
| THREAD SERIES DESIGNATOR | UNF |
| FEATURES PROVIDED | HERMETICALLY SEALED CASE |
| MOUNTING METHOD | THREADED STUD(S) |
| MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 190.0 CELSIUS JUNCTION DEGC |
| MOUNTING FACILITY QUANTITY | 1 |
| NOMINAL THREAD SIZE | 0.190 INCHES IN |
| OVERALL WIDTH ACROSS FLATS | 0.437 INCHES NOMINAL IN |
| OVERALL LENGTH | 1.171 INCHES MAXIMUM IN |
| POWER RATING PER CHARACTERISTIC | 18.0 WATTS MAXIMUM TOTAL POWER DISSIPATION |
| VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 100.0 MAXIMUM REVERSE VOLTAGE, PEAK |