19B219800G3: SEMICONDUCTOR DEVICE,DIODE.
The SEMICONDUCTOR DEVICE,DIODE is a the manufacturer industrial component. Key specifications include material: SILICON SEMICONDUCTOR, overall_length: 0.405 INCHES NOMINAL IN, mounting_method: TERMINAL, terminal_length: 3.000 INCHES NOMINAL IN, special_features: LEADS MUST BE HEAT SUNK SOLDERED; JUNCTION PATTERN ARRANGEMENT: PN, terminal_type_and_quantity: 2 UNINSULATED WIRE LEAD. This part is cataloged in the U.S.
Government catalog under NSN 5961-01-062-3491, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| material | SILICON SEMICONDUCTOR |
| overall_length | 0.405 INCHES NOMINAL IN |
| mounting_method | TERMINAL |
| terminal_length | 3.000 INCHES NOMINAL IN |
| special_features | LEADS MUST BE HEAT SUNK SOLDERED; JUNCTION PATTERN ARRANGEMENT: PN |
| terminal_type_and_quantity | 2 UNINSULATED WIRE LEAD |
| NSN | 5961-01-062-3491 |
| TERMINAL LENGTH | 3.000 INCHES NOMINAL IN |
| MOUNTING METHOD | TERMINAL |
| OVERALL LENGTH | 0.405 INCHES NOMINAL IN |
| SPECIAL FEATURES | LEADS MUST BE HEAT SUNK SOLDERED; JUNCTION PATTERN ARRANGEMENT: PN |
| MATERIAL | SILICON SEMICONDUCTOR |
| TERMINAL TYPE AND QUANTITY | 2 UNINSULATED WIRE LEAD |
No substitute or cross-reference records for this part.