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Technical Data Sheet
1908509P2 ✓ Verified by PartsTable
· COMPONENT
WHAT YOU NEED TO KNOW
Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel
Confirm exact part number — similar PNs may be different parts
PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.300 INCHES MAXIMUM IN, body_height: 0.175 INCHES MAXIMUM IN, body_length: 0.790 INCHES MAXIMUM IN, bit_quantity: 1024, word_quantity: 256, features_provided: 3-STATE OUTPUT AND MONOLITHIC AND PROGRAMMED. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-240-7600, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
1908509P2
NSN: 5962-01-240-7600
FSC: 5962
CAGE: 94117 — BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC. DBA BAE SYSTEMS (USA)
SPECIFICATIONS
body_width0.300 INCHES MAXIMUM IN
body_height0.175 INCHES MAXIMUM IN
body_length0.790 INCHES MAXIMUM IN
bit_quantity1024
word_quantity256
features_provided3-STATE OUTPUT AND MONOLITHIC AND PROGRAMMED
output_logic_formTRANSISTOR-TRANSISTOR LOGIC
inclosure_materialCERAMIC
memory_device_typeROM
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range+0.0 TO 75.0 CELSIUS DEGC
input_circuit_pattern9 INPUT
NSN5962-01-240-7600
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN 1908509P2 MFR MICROCIRCUIT,MEMORY
KEY FEATURES
FEATURES PROVIDED: 3-STATE OUTPUT AND MONOLITHIC AND PROGRAMMED
BODY HEIGHT: 0.175 INCHES MAXIMUM IN
BIT QUANTITY: 1024
WORD QUANTITY: 256
STORAGE TEMP RANGE: -65.0 TO 150.0 CELSIUS DEGC
BODY WIDTH: 0.300 INCHES MAXIMUM IN
INCLOSURE CONFIGURATION: DUAL-IN-LINE
INCLOSURE MATERIAL: CERAMIC
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS (FLIS)
FEATURES PROVIDED3-STATE OUTPUT AND MONOLITHIC AND PROGRAMMED
BODY HEIGHT0.175 INCHES MAXIMUM IN
BIT QUANTITY1024
WORD QUANTITY256
STORAGE TEMP RANGE-65.0 TO 150.0 CELSIUS DEGC
BODY WIDTH0.300 INCHES MAXIMUM IN
INCLOSURE CONFIGURATIONDUAL-IN-LINE
INCLOSURE MATERIALCERAMIC
TERMINAL TYPE AND QUANTITY16 PRINTED CIRCUIT
MEMORY DEVICE TYPEROM
VERIFIED SUBSTITUTES & CROSS-REFERENCES 22
51022-0013Interchangeable
interchangeable cross-reference
interchangeable
ROM/PROM FAMILY 005Interchangeable
interchangeable cross-reference
interchangeable
ROM/PROMInterchangeable
interchangeable cross-reference
interchangeable
1088777T1Interchangeable
interchangeable cross-reference
interchangeable
1086960P10Interchangeable
interchangeable cross-reference
interchangeable
6301-1JInterchangeable
interchangeable cross-reference
interchangeable
LIFECYCLE
StatusACTIVE
AvailabilityOEM and secondary market
RoHS CompliantEAR99ESD SensitiveNot HAZMAT
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FREQUENTLY ASKED QUESTIONS
What is 1908509P2?
1908509P2 is a MICROCIRCUIT,MEMORY.
What parts can replace 1908509P2?
There are 22 known substitutes for 1908509P2: 51022-0013, ROM/PROM FAMILY 005, ROM/PROM and 19 more. Substitute compatibility should be verified for your specific system.
What is the NSN for 1908509P2?
1908509P2 is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-240-7600. This indicates validated use in U.S. government and defense supply chains.
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