1901-0001: SEMICONDUCTOR DEVICE,DIODE.
The SEMICONDUCTOR DEVICE,DIODE is a Leitz industrial component. Key specifications include material: SILICON SEMICONDUCTOR, thread_class: 2A A, thread_length: 0.625 INCHES NOMINAL IN, thread_series: UNF, mounting_style: BRACKET MTD W/THREE MTG HOLES, TOP HOLE THREADED, overall_length: 0.300 INCHES MAXIMUM IN. This part is cataloged in the U.S.
Government catalog under NSN 2920-00-231-7270, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| material | SILICON SEMICONDUCTOR |
| thread_class | 2A A |
| thread_length | 0.625 INCHES NOMINAL IN |
| thread_series | UNF |
| mounting_style | BRACKET MTD W/THREE MTG HOLES, TOP HOLE THREADED |
| overall_length | 0.300 INCHES MAXIMUM IN |
| submersibility | NONSUBMERSIBLE |
| furnished_items | LOCKWASHER AND NUT |
| mounting_method | TERMINAL |
| terminal_length | 0.200 INCHES MINIMUM IN |
| thread_diameter | 0.625 INCHES NOMINAL IN |
| grounding_method | EXTERNAL |
| NSN | 2920-00-231-7270 |
| DISTANCE BETWEEN SHAFT CENTER AND BOTTOM MOUNTING HOLE CENTER | 3.890 INCHES MINIMUM AND 3.910 INCHES MAXIMUM IN |
| SHAFT DRIVE END STYLE | STRAIGHT SHAFT END, THREADED |
| DISTANCE BETWEEN OUTSIDE SURFACES OF HINGE BRACKET | 5.060 INCHES MINIMUM AND 5.130 INCHES MAXIMUM IN |
| GROUNDING METHOD | EXTERNAL |
| THREAD SERIES | UNF |
| DISTANCE BETWEEN INSIDE SURFACES OF HINGE BRACKET | 3.940 INCHES MINIMUM AND 4.010 INCHES MAXIMUM IN |
| THREAD LENGTH | 0.625 INCHES NOMINAL IN |
| BOTTOM MOUNTING HOLE DIAMETER | 0.513 INCHES MINIMUM AND 0.523 INCHES MAXIMUM IN |
| MOUNTING STYLE | BRACKET MTD W/THREE MTG HOLES, TOP HOLE THREADED |
| VOLTAGE IN VOLTS | 24.0 |