1826-1473: MICROCIRCUIT,LINEAR.
The MICROCIRCUIT,LINEAR is a the manufacturer industrial component. Key specifications include body_height: 0.065 INCHES MINIMUM AND 0.085 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND LOW IMPEDANCE, inclosure_material: METAL, storage_temp_range: -60.0 TO 180.0 CELSIUS DEGC, operating_temp_range: -55.0 TO 150.0 CELSIUS DEGC, body_outside_diameter: 0.209 INCHES MINIMUM AND 0.230 INCHES MAXIMUM IN. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-263-6980, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_height | 0.065 INCHES MINIMUM AND 0.085 INCHES MAXIMUM IN |
| features_provided | HERMETICALLY SEALED AND LOW IMPEDANCE |
| inclosure_material | METAL |
| storage_temp_range | -60.0 TO 180.0 CELSIUS DEGC |
| operating_temp_range | -55.0 TO 150.0 CELSIUS DEGC |
| body_outside_diameter | 0.209 INCHES MINIMUM AND 0.230 INCHES MAXIMUM IN |
| input_circuit_pattern | 1 INPUT |
| end_item_identification | 1440-01-215-4868 ARMAMENT SUBSYS |
| inclosure_configuration | CAN |
| terminal_surface_treatment | SOLDER |
| terminal_type_and_quantity | 3 PIN |
| design_function_and_quantity | 1 SENSOR |
| NSN | 5962-01-263-6980 |
| INPUT CIRCUIT PATTERN | 1 INPUT |
| INCLOSURE MATERIAL | METAL |
| TERMINAL SURFACE TREATMENT | SOLDER |
| BODY OUTSIDE DIAMETER | 0.209 INCHES MINIMUM AND 0.230 INCHES MAXIMUM IN |
| DESIGN FUNCTION AND QUANTITY | 1 SENSOR |
| BODY HEIGHT | 0.065 INCHES MINIMUM AND 0.085 INCHES MAXIMUM IN |
| FEATURES PROVIDED | HERMETICALLY SEALED AND LOW IMPEDANCE |
| INCLOSURE CONFIGURATION | CAN |
| CASE OUTLINE SOURCE AND DESIGNATOR | TO-46 JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
| STORAGE TEMP RANGE | -60.0 TO 180.0 CELSIUS DEGC |