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1820-6539 — MICROCIRCUIT,MEMORY

✓ Government record, cited
— · COMPONENT
PRODUCT OVERVIEW

1820-6539: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 1.340 INCHES MINIMUM AND 1.380 INCHES MAXIMUM IN, body_height: 0.100 INCHES MINIMUM AND 0.150 INCHES MAXIMUM IN, body_length: 1.340 INCHES MINIMUM AND 1.380 INCHES MAXIMUM IN, features_provided: ELECTROSTATIC SENSITIVE AND PROGRAMMED, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: PLASTIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-378-2415, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
1820-6539
NSN: 5962-01-378-2415
FSC: 5962 — Microcircuits, Electronic
CAGE: 7ZXR5 — KEYSIGHT TECHNOLOGIES INC (USA)
SPECIFICATIONS
body_width1.340 INCHES MINIMUM AND 1.380 INCHES MAXIMUM IN
body_height0.100 INCHES MINIMUM AND 0.150 INCHES MAXIMUM IN
body_length1.340 INCHES MINIMUM AND 1.380 INCHES MAXIMUM IN
features_providedELECTROSTATIC SENSITIVE AND PROGRAMMED
output_logic_formCOMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_materialPLASTIC
memory_device_typePAL
operating_temp_range-20.0 TO 125.0 CELSIUS DEGC
inclosure_configurationPIN GRID ARRAY
terminal_surface_treatmentSOLDER
NSN5962-01-378-2415
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN 1820-6539 MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
INCLOSURE MATERIAL: PLASTIC
•
TERMINAL SURFACE TREATMENT: SOLDER
•
BODY WIDTH: 1.340 INCHES MINIMUM AND 1.380 INCHES MAXIMUM IN
•
BODY HEIGHT: 0.100 INCHES MINIMUM AND 0.150 INCHES MAXIMUM IN
•
FEATURES PROVIDED: ELECTROSTATIC SENSITIVE AND PROGRAMMED
•
INCLOSURE CONFIGURATION: PIN GRID ARRAY
•
MEMORY DEVICE TYPE: PAL
•
BODY LENGTH: 1.340 INCHES MINIMUM AND 1.380 INCHES MAXIMUM IN
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS
INCLOSURE MATERIALPLASTIC
TERMINAL SURFACE TREATMENTSOLDER
BODY WIDTH1.340 INCHES MINIMUM AND 1.380 INCHES MAXIMUM IN
BODY HEIGHT0.100 INCHES MINIMUM AND 0.150 INCHES MAXIMUM IN
FEATURES PROVIDEDELECTROSTATIC SENSITIVE AND PROGRAMMED
INCLOSURE CONFIGURATIONPIN GRID ARRAY
MEMORY DEVICE TYPEPAL
BODY LENGTH1.340 INCHES MINIMUM AND 1.380 INCHES MAXIMUM IN
OUTPUT LOGIC FORMCOMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
OPERATING TEMP RANGE-20.0 TO 125.0 CELSIUS DEGC
OTHER ITEMS IN FSC 5962 — Microcircuits, Electronic
Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.
5962-00-001-1861 5962-00-001-1901 5962-00-001-1902 5962-00-001-1905 5962-00-001-1906 5962-00-001-1907 5962-00-001-1908 5962-00-001-1909
SUBSTITUTES & CROSS-REFERENCES 2
XC3030-70PC84CSame NSN cross-reference
Same NSN cross-reference
Also cataloged under this NSN
3030-70MB4Reference document
Same NSN cross-reference
Reference document — Secondary reference
LIFECYCLE
NSN statusActive· U.S. Government catalog
Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation + specific procedure
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FREQUENTLY ASKED QUESTIONS
What is 1820-6539?
1820-6539 is a MICROCIRCUIT,MEMORY.
What parts can replace 1820-6539?
There are 2 known substitutes for 1820-6539: XC3030-70PC84C, 3030-70MB4. Substitute compatibility should be verified for your specific system.
What is the NSN for 1820-6539?
1820-6539 is cataloged in the U.S. Government catalog under NSN 5962-01-378-2415. This indicates validated use in U.S. government and defense supply chains.
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