The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN, body_height: 0.185 INCHES MAXIMUM IN, body_length: 0.785 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND BURN IN AND SCHOTTKY AND LOW POWER, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-217-7206, indicating validated use in U.S.
government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels. Verify compatibility with your specific system configuration before ordering.
| body_width | 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN |
| body_height | 0.185 INCHES MAXIMUM IN |
| body_length | 0.785 INCHES MAXIMUM IN |
| features_provided | HERMETICALLY SEALED AND BURN IN AND SCHOTTKY AND LOW POWER |
| output_logic_form | TRANSISTOR-TRANSISTOR LOGIC |
| inclosure_material | CERAMIC |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | TRIPLE 3 INPUT |
| inclosure_configuration | DUAL-IN-LINE |
| terminal_surface_treatment | SOLDER |
| terminal_type_and_quantity | 14 PRINTED CIRCUIT |
| NSN | 5962-01-217-7206 |
| INCLOSURE MATERIAL | CERAMIC |
| TEST DATA DOCUMENT | 81349-MIL-M-38510 SPECIFICATION (INCLUDES ENGINEERING TYPE BULLETINS, BROCHURES,ETC., THAT REFLECT SPECIFICATION TYPE DATA IN SPECIFICATION FORMAT; EXCLUDES COMMERCIAL CATALOGS, INDUSTRY DIRECTORIES, AND SIMILAR TRADE PUBLICATIONS, REFLECTING GENERAL TYPE DATA ON CERTAIN ENVIRONMENTAL AND PERFORMANCE REQUIREMENTS AND TEST CONDITIONS THAT ARE SHOWN AS "TYPICAL", "AVERAGE", "NOMINAL", ETC.). |
| BODY LENGTH | 0.785 INCHES MAXIMUM IN |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS DEGC |
| CASE OUTLINE SOURCE AND DESIGNATOR | D-1 MIL-M-38510 |
| SPECIFICATION/STANDARD DATA | 81349-MIL-M-38510/370 GOVERNMENT SPECIFICATION |
| OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| INPUT CIRCUIT PATTERN | TRIPLE 3 INPUT |
| TERMINAL SURFACE TREATMENT | SOLDER |