The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.245 INCHES MINIMUM AND 0.280 INCHES MAXIMUM IN, body_height: 0.140 INCHES MINIMUM AND 0.180 INCHES MAXIMUM IN, body_length: 0.755 INCHES MINIMUM AND 0.785 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND HIGH SPEED AND MONOLITHIC AND POSITIVE OUTPUTS AND PROGRAMMABLE, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC AND GLASS. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-00-512-8830, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.245 INCHES MINIMUM AND 0.280 INCHES MAXIMUM IN |
| body_height | 0.140 INCHES MINIMUM AND 0.180 INCHES MAXIMUM IN |
| body_length | 0.755 INCHES MINIMUM AND 0.785 INCHES MAXIMUM IN |
| features_provided | HERMETICALLY SEALED AND HIGH SPEED AND MONOLITHIC AND POSITIVE OUTPUTS AND PROGRAMMABLE |
| output_logic_form | TRANSISTOR-TRANSISTOR LOGIC |
| inclosure_material | CERAMIC AND GLASS |
| memory_device_type | ROM |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | 9 INPUT |
| inclosure_configuration | DUAL-IN-LINE |
| terminal_surface_treatment | SOLDER |
| NSN | 5962-00-512-8830 |
| OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS DEGC |
| BODY LENGTH | 0.785 INCHES MAXIMUM IN |
| BODY HEIGHT | 0.200 INCHES MAXIMUM IN |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| BODY WIDTH | 0.280 INCHES MAXIMUM IN |
| INCLOSURE MATERIAL | CERAMIC |