1818-3327 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

1818-3327: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.365 INCHES MAXIMUM IN, body_height: 0.165 INCHES MAXIMUM IN, body_length: 1.095 INCHES MAXIMUM IN, overall_width: 0.405 INCHES MAXIMUM IN, overall_height: 0.345 INCHES MAXIMUM IN, overall_length: 1.095 INCHES MAXIMUM IN. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-309-6882, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

1818-3327

NSN: 5962-01-309-6882
FSC: 5962 — Microcircuits, Electronic
CAGE: 28480 — HEWLETT-PACKARD COMPANY DBA HP (USA)

SPECIFICATIONS

body_width	0.365 INCHES MAXIMUM IN
body_height	0.165 INCHES MAXIMUM IN
body_length	1.095 INCHES MAXIMUM IN
overall_width	0.405 INCHES MAXIMUM IN
overall_height	0.345 INCHES MAXIMUM IN
overall_length	1.095 INCHES MAXIMUM IN
features_provided	BURN IN AND ELECTROSTATIC SENSITIVE
output_logic_form	N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	PLASTIC
memory_device_type	RAM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
NSN	5962-01-309-6882

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 13 INPUT

•

INCLOSURE MATERIAL: PLASTIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.365 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.165 INCHES MAXIMUM IN

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

OVERALL HEIGHT	0.345 INCHES MAXIMUM IN
INPUT CIRCUIT PATTERN	13 INPUT
INCLOSURE MATERIAL	PLASTIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.365 INCHES MAXIMUM IN
BODY HEIGHT	0.165 INCHES MAXIMUM IN
OVERALL LENGTH	1.095 INCHES MAXIMUM IN
OVERALL WIDTH	0.405 INCHES MAXIMUM IN
FEATURES PROVIDED	BURN IN AND ELECTROSTATIC SENSITIVE
INCLOSURE CONFIGURATION	DUAL-IN-LINE

OTHER ITEMS IN FSC 5962 — Microcircuits, Electronic

Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.

5962-00-001-1861 5962-00-001-1901 5962-00-001-1902 5962-00-001-1905 5962-00-001-1906 5962-00-001-1907 5962-00-001-1908 5962-00-001-1909

SUBSTITUTES & CROSS-REFERENCES 1

AM91L22-35PCReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Terminal item — no further procurement; issued until stock is exhaustedDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is 1818-3327?

1818-3327 is a MICROCIRCUIT,MEMORY.

What parts can replace 1818-3327?

There is 1 known substitute for 1818-3327: AM91L22-35PC. Substitute compatibility should be verified for your specific system.

What is the NSN for 1818-3327?

1818-3327 is cataloged in the U.S. Government catalog under NSN 5962-01-309-6882. This indicates validated use in U.S. government and defense supply chains.

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