1818-2270 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

1818-2270: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include features_provided: HERMETICALLY SEALED, output_logic_form: N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC, memory_device_type: ROM, inclosure_configuration: DUAL-IN-LINE, terminal_surface_treatment: SOLDER. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-082-6056, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

1818-2270

NSN: 5962-01-082-6056
FSC: 5962 — Microcircuits, Electronic
CAGE: 7ZXR5 — KEYSIGHT TECHNOLOGIES INC (USA)

SPECIFICATIONS

features_provided	HERMETICALLY SEALED
output_logic_form	N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	ROM
end_item_identification	HELICOPTER, MH-53E; CARRIER BASED ASW, SH-60F; USCG SEARCH & RESCUE, HH-60J; ADVANCE ATTACK, AH-1W; SEARCH AND RESCUE, HH-60H; AIRCRAFT, VIKNG S-3B, HAWKEYE E-2C, TOMCAT F-14, INTRUDER A-6E W
inclosure_configuration	DUAL-IN-LINE
terminal_surface_treatment	SOLDER
NSN	5962-01-082-6056

COMPONENT DIAGRAM

KEY FEATURES

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

FEATURES PROVIDED: HERMETICALLY SEALED

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: ROM

•

OUTPUT LOGIC FORM: N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC

•

TERMINAL TYPE AND QUANTITY: 24 PRINTED CIRCUIT

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
FEATURES PROVIDED	HERMETICALLY SEALED
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	ROM
OUTPUT LOGIC FORM	N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
END ITEM IDENTIFICATION	HELICOPTER, MH-53E; CARRIER BASED ASW, SH-60F; USCG SEARCH & RESCUE, HH-60J; ADVANCE ATTACK, AH-1W; SEARCH AND RESCUE, HH-60H; AIRCRAFT, VIKNG S-3B, HAWKEYE E-2C, TOMCAT F-14, INTRUDER A-6E W
TERMINAL TYPE AND QUANTITY	24 PRINTED CIRCUIT

OTHER ITEMS IN FSC 5962 — Microcircuits, Electronic

Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.

5962-00-001-1861 5962-00-001-1901 5962-00-001-1902 5962-00-001-1905 5962-00-001-1906 5962-00-001-1907 5962-00-001-1908 5962-00-001-1909

SUBSTITUTES & CROSS-REFERENCES 1

ROM/PROMReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is 1818-2270?

1818-2270 is a MICROCIRCUIT,MEMORY.

What parts can replace 1818-2270?

There is 1 known substitute for 1818-2270: ROM/PROM. Substitute compatibility should be verified for your specific system.

What is the NSN for 1818-2270?

1818-2270 is cataloged in the U.S. Government catalog under NSN 5962-01-082-6056. This indicates validated use in U.S. government and defense supply chains.

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