1818-1870 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

1818-1870: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.540 INCHES NOMINAL IN, body_height: 0.150 INCHES NOMINAL IN, body_length: 1.400 INCHES MAXIMUM IN, memory_capacity: UNKNOWN, features_provided: HIGH PERFORMANCE AND LOW POWER AND W/STORAGE AND W/CLOCK AND W/BUFFERED OUTPUT, output_logic_form: N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-240-9247, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

1818-1870

NSN: 5962-01-240-9247
FSC: 5962 — Microcircuits, Electronic
CAGE: 28480 — HEWLETT-PACKARD COMPANY DBA HP (USA)

SPECIFICATIONS

body_width	0.540 INCHES NOMINAL IN
body_height	0.150 INCHES NOMINAL IN
body_length	1.400 INCHES MAXIMUM IN
memory_capacity	UNKNOWN
features_provided	HIGH PERFORMANCE AND LOW POWER AND W/STORAGE AND W/CLOCK AND W/BUFFERED OUTPUT
output_logic_form	N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	PLASTIC
memory_device_type	ROM
storage_temp_range	-55.0 TO 125.0 CELSIUS DEGC
operating_temp_range	+0.0 TO 70.0 CELSIUS DEGC
input_circuit_pattern	14 INPUT
end_item_identification	COMPUTER,DIGITAL CP-1769/G
NSN	5962-01-240-9247

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 14 INPUT

•

INCLOSURE MATERIAL: PLASTIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.540 INCHES NOMINAL IN

•

BODY HEIGHT: 0.150 INCHES NOMINAL IN

•

FEATURES PROVIDED: HIGH PERFORMANCE AND LOW POWER AND W/STORAGE AND W/CLOCK AND W/BUFFERED OUTPUT

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: ROM

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	14 INPUT
INCLOSURE MATERIAL	PLASTIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.540 INCHES NOMINAL IN
BODY HEIGHT	0.150 INCHES NOMINAL IN
FEATURES PROVIDED	HIGH PERFORMANCE AND LOW POWER AND W/STORAGE AND W/CLOCK AND W/BUFFERED OUTPUT
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	ROM
BODY LENGTH	1.400 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-55.0 TO 125.0 CELSIUS DEGC

SUBSTITUTES & CROSS-REFERENCES 2

ROM/PROMReference document

Same NSN cross-reference

Reference document — Secondary reference

MK36000N-4Reference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Terminal item — stock exhausted; no further procurementDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is 1818-1870?

1818-1870 is a MICROCIRCUIT,MEMORY.

What parts can replace 1818-1870?

There are 2 known substitutes for 1818-1870: ROM/PROM, MK36000N-4. Substitute compatibility should be verified for your specific system.

What is the NSN for 1818-1870?

1818-1870 is cataloged in the U.S. Government catalog under NSN 5962-01-240-9247. This indicates validated use in U.S. government and defense supply chains.

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