1818-0831 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

1818-0831: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.500 INCHES NOMINAL IN, body_height: 0.187 INCHES NOMINAL IN, body_length: 1.250 INCHES NOMINAL IN, memory_capacity: UNKNOWN, features_provided: HERMETICALLY SEALED AND W/ENABLE AND 3-STATE OUTPUT AND HIGH PERFORMANCE, output_logic_form: N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-165-3107, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

1818-0831

NSN: 5962-01-165-3107
FSC: 5962 — Microcircuits, Electronic
CAGE: 7ZXR5 — KEYSIGHT TECHNOLOGIES INC (USA)

SPECIFICATIONS

body_width	0.500 INCHES NOMINAL IN
body_height	0.187 INCHES NOMINAL IN
body_length	1.250 INCHES NOMINAL IN
memory_capacity	UNKNOWN
features_provided	HERMETICALLY SEALED AND W/ENABLE AND 3-STATE OUTPUT AND HIGH PERFORMANCE
output_logic_form	N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	ROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	+0.0 TO 70.0 CELSIUS DEGC
input_circuit_pattern	14 INPUT
end_item_identification	TEST SET 9900A A
NSN	5962-01-165-3107

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 14 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.500 INCHES NOMINAL IN

•

BODY HEIGHT: 0.187 INCHES NOMINAL IN

•

FEATURES PROVIDED: HERMETICALLY SEALED AND W/ENABLE AND 3-STATE OUTPUT AND HIGH PERFORMANCE

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: ROM

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	14 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.500 INCHES NOMINAL IN
BODY HEIGHT	0.187 INCHES NOMINAL IN
FEATURES PROVIDED	HERMETICALLY SEALED AND W/ENABLE AND 3-STATE OUTPUT AND HIGH PERFORMANCE
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	ROM
BODY LENGTH	1.250 INCHES NOMINAL IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC

SUBSTITUTES & CROSS-REFERENCES 3

MK36000P-4Reference document

Same NSN cross-reference

Reference document — Secondary reference

MK36000P-4 MASKEDReference document

Same NSN cross-reference

Reference document — Secondary reference

MK36064Same NSN cross-reference

Same NSN cross-reference

Also cataloged under this NSN

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Terminal item — stock exhausted; no further procurementDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is 1818-0831?

1818-0831 is a MICROCIRCUIT,MEMORY.

What parts can replace 1818-0831?

There are 3 known substitutes for 1818-0831: MK36000P-4, MK36000P-4 MASKED, MK36064. Substitute compatibility should be verified for your specific system.

What is the NSN for 1818-0831?

1818-0831 is cataloged in the U.S. Government catalog under NSN 5962-01-165-3107. This indicates validated use in U.S. government and defense supply chains.

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