1818-0789 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

1818-0789: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN, body_height: 0.140 INCHES MINIMUM AND 0.170 INCHES MAXIMUM IN, body_length: 1.230 INCHES MINIMUM AND 1.290 INCHES MAXIMUM IN, memory_capacity: UNKNOWN, features_provided: PROGRAMMABLE AND HERMETICALLY SEALED AND 3-STATE OUTPUT AND COMPATIBLE DTL, output_logic_form: N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-141-5685, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

1818-0789

NSN: 5962-01-141-5685
FSC: 5962 — Microcircuits, Electronic
CAGE: 7ZXR5 — KEYSIGHT TECHNOLOGIES INC (USA)

SPECIFICATIONS

body_width	0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN
body_height	0.140 INCHES MINIMUM AND 0.170 INCHES MAXIMUM IN
body_length	1.230 INCHES MINIMUM AND 1.290 INCHES MAXIMUM IN
memory_capacity	UNKNOWN
features_provided	PROGRAMMABLE AND HERMETICALLY SEALED AND 3-STATE OUTPUT AND COMPATIBLE DTL
output_logic_form	N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC AND GLASS
memory_device_type	ROM
storage_temp_range	-55.0 TO 125.0 CELSIUS DEGC
operating_temp_range	+0.0 TO 70.0 CELSIUS DEGC
input_circuit_pattern	12 INPUT
end_item_identification	4920-01-084-7157 26916
NSN	5962-01-141-5685

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 12 INPUT

•

INCLOSURE MATERIAL: CERAMIC AND GLASS

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.140 INCHES MINIMUM AND 0.170 INCHES MAXIMUM IN

•

FEATURES PROVIDED: PROGRAMMABLE AND HERMETICALLY SEALED AND 3-STATE OUTPUT AND COMPATIBLE DTL

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: ROM

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	12 INPUT
INCLOSURE MATERIAL	CERAMIC AND GLASS
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN
BODY HEIGHT	0.140 INCHES MINIMUM AND 0.170 INCHES MAXIMUM IN
FEATURES PROVIDED	PROGRAMMABLE AND HERMETICALLY SEALED AND 3-STATE OUTPUT AND COMPATIBLE DTL
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	ROM
BODY LENGTH	1.230 INCHES MINIMUM AND 1.290 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-55.0 TO 125.0 CELSIUS DEGC

SUBSTITUTES & CROSS-REFERENCES 1

MCM6832CReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Terminal item — stock exhausted; no further procurementDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is 1818-0789?

1818-0789 is a MICROCIRCUIT,MEMORY.

What parts can replace 1818-0789?

There is 1 known substitute for 1818-0789: MCM6832C. Substitute compatibility should be verified for your specific system.

What is the NSN for 1818-0789?

1818-0789 is cataloged in the U.S. Government catalog under NSN 5962-01-141-5685. This indicates validated use in U.S. government and defense supply chains.

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1818-0789 — MICROCIRCUIT,MEMORY

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