Name: MICROCIRCUIT,MEMORY
Brand: Unknown
SKU: 1818-0735

1818-0735 ✓ Verified by PartsTable

— · COMPONENT

WHAT YOU NEED TO KNOW

Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel

Confirm exact part number — similar PNs may be different parts

PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.515 INCHES MINIMUM AND 0.600 INCHES MAXIMUM IN, body_height: 0.205 INCHES MAXIMUM IN, body_length: 2.030 INCHES MINIMUM AND 2.080 INCHES MAXIMUM IN, special_features: WEAPON SYSTEM ESSENTIAL, features_provided: HERMETICALLY SEALED AND STATIC OPERATION AND PROGRAMMABLE, output_logic_form: METAL OXIDE-SEMICONDUCTOR LOGIC. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-083-2249, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

1818-0735

NSN: 5962-01-083-2249
FSC: 5962
CAGE: 28480 — HEWLETT-PACKARD COMPANY DBA HP (USA)

SPECIFICATIONS

body_width	0.515 INCHES MINIMUM AND 0.600 INCHES MAXIMUM IN
body_height	0.205 INCHES MAXIMUM IN
body_length	2.030 INCHES MINIMUM AND 2.080 INCHES MAXIMUM IN
special_features	WEAPON SYSTEM ESSENTIAL
features_provided	HERMETICALLY SEALED AND STATIC OPERATION AND PROGRAMMABLE
output_logic_form	METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	RAM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	+0.0 TO 70.0 CELSIUS DEGC
input_circuit_pattern	38 INPUT
inclosure_configuration	DUAL-IN-LINE
NSN	5962-01-083-2249

COMPONENT DIAGRAM

KEY FEATURES

•

BODY HEIGHT: 0.205 INCHES MAXIMUM IN

•

OPERATING TEMP RANGE: +0.0 TO 70.0 CELSIUS DEGC

•

STORAGE TEMP RANGE: -65.0 TO 150.0 CELSIUS DEGC

•

OUTPUT LOGIC FORM: METAL OXIDE-SEMICONDUCTOR LOGIC

•

INPUT CIRCUIT PATTERN: 38 INPUT

•

MEMORY DEVICE TYPE: RAM

•

CRITICALITY CODE JUSTIFICATION: FEAT

•

VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 7.0 VOLTS MAXIMUM POWER SOURCE

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS (FLIS)

BODY HEIGHT	0.205 INCHES MAXIMUM IN
OPERATING TEMP RANGE	+0.0 TO 70.0 CELSIUS DEGC
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC
OUTPUT LOGIC FORM	METAL OXIDE-SEMICONDUCTOR LOGIC
INPUT CIRCUIT PATTERN	38 INPUT
MEMORY DEVICE TYPE	RAM
CRITICALITY CODE JUSTIFICATION	FEAT
VOLTAGE RATING AND TYPE PER CHARACTERISTIC	7.0 VOLTS MAXIMUM POWER SOURCE
TERMINAL TYPE AND QUANTITY	40 PRINTED CIRCUIT
TERMINAL SURFACE TREATMENT	SOLDER

VERIFIED SUBSTITUTES & CROSS-REFERENCES 21

8155Interchangeable