1818-0668 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

1818-0668: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.580 INCHES MINIMUM AND 0.620 INCHES MAXIMUM IN, body_height: 0.150 INCHES MINIMUM AND 0.180 INCHES MAXIMUM IN, body_length: 1.230 INCHES MAXIMUM IN, memory_capacity: UNKNOWN, output_logic_form: N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC AND GLASS. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-142-5129, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

1818-0668

NSN: 5962-01-142-5129
FSC: 5962 — Microcircuits, Electronic
CAGE: 7ZXR5 — KEYSIGHT TECHNOLOGIES INC (USA)

SPECIFICATIONS

body_width	0.580 INCHES MINIMUM AND 0.620 INCHES MAXIMUM IN
body_height	0.150 INCHES MINIMUM AND 0.180 INCHES MAXIMUM IN
body_length	1.230 INCHES MAXIMUM IN
memory_capacity	UNKNOWN
features_provided	HERMETICALLY SEALED AND 3-STATE OUTPUT AND HIGH PERFORMANCE AND LOW POWER AND PROGRAMMED AND HIGH IMPEDANCE AND WIRE-OR OUTPUTS
output_logic_form	N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC AND GLASS
memory_device_type	ROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	+0.0 TO 70.0 CELSIUS DEGC
input_circuit_pattern	14 INPUT
end_item_identification	SPECTRUM ANAL 28480
NSN	5962-01-142-5129

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 14 INPUT

•

INCLOSURE MATERIAL: CERAMIC AND GLASS

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.580 INCHES MINIMUM AND 0.620 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.150 INCHES MINIMUM AND 0.180 INCHES MAXIMUM IN

•

FEATURES PROVIDED: HERMETICALLY SEALED AND 3-STATE OUTPUT AND HIGH PERFORMANCE AND LOW POWER AND PROGRAMMED AND HIGH IMPEDANCE AND WIRE-OR OUTPUTS

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: ROM

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	14 INPUT
INCLOSURE MATERIAL	CERAMIC AND GLASS
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.580 INCHES MINIMUM AND 0.620 INCHES MAXIMUM IN
BODY HEIGHT	0.150 INCHES MINIMUM AND 0.180 INCHES MAXIMUM IN
FEATURES PROVIDED	HERMETICALLY SEALED AND 3-STATE OUTPUT AND HIGH PERFORMANCE AND LOW POWER AND PROGRAMMED AND HIGH IMPEDANCE AND WIRE-OR OUTPUTS
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	ROM
BODY LENGTH	1.230 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC

SUBSTITUTES & CROSS-REFERENCES 3

AM9218CDC31484Same NSN cross-reference

Same NSN cross-reference

Also cataloged under this NSN

MK34000P-3Reference document

Same NSN cross-reference

Reference document — Secondary reference

AM9218CDCReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is 1818-0668?

1818-0668 is a MICROCIRCUIT,MEMORY.

What parts can replace 1818-0668?

There are 3 known substitutes for 1818-0668: AM9218CDC31484, MK34000P-3, AM9218CDC. Substitute compatibility should be verified for your specific system.

What is the NSN for 1818-0668?

1818-0668 is cataloged in the U.S. Government catalog under NSN 5962-01-142-5129. This indicates validated use in U.S. government and defense supply chains.

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