1816-1270 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

1816-1270: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.260 INCHES MAXIMUM IN, body_height: 0.180 INCHES MAXIMUM IN, body_length: 0.870 INCHES MAXIMUM IN, memory_capacity: UNKNOWN, features_provided: MONOLITHIC AND BIPOLAR AND 3-STATE OUTPUT AND PROGRAMMED AND SCHOTTKY, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-095-2374, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

1816-1270

NSN: 5962-01-095-2374
FSC: 5962 — Microcircuits, Electronic
CAGE: 1LQK8 — KEYSIGHT TECHNOLOGIES, INC. (USA)

SPECIFICATIONS

body_width	0.260 INCHES MAXIMUM IN
body_height	0.180 INCHES MAXIMUM IN
body_length	0.870 INCHES MAXIMUM IN
memory_capacity	UNKNOWN
features_provided	MONOLITHIC AND BIPOLAR AND 3-STATE OUTPUT AND PROGRAMMED AND SCHOTTKY
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	PLASTIC
memory_device_type	ROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	+0.0 TO 70.0 CELSIUS DEGC
input_circuit_pattern	6 INPUT
inclosure_configuration	DUAL-IN-LINE
NSN	5962-01-095-2374

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 6 INPUT

•

INCLOSURE MATERIAL: PLASTIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.260 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.180 INCHES MAXIMUM IN

•

FEATURES PROVIDED: MONOLITHIC AND BIPOLAR AND 3-STATE OUTPUT AND PROGRAMMED AND SCHOTTKY

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: ROM

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	6 INPUT
INCLOSURE MATERIAL	PLASTIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.260 INCHES MAXIMUM IN
BODY HEIGHT	0.180 INCHES MAXIMUM IN
FEATURES PROVIDED	MONOLITHIC AND BIPOLAR AND 3-STATE OUTPUT AND PROGRAMMED AND SCHOTTKY
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	ROM
BODY LENGTH	0.870 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC

SUBSTITUTES & CROSS-REFERENCES 4

A-1816-1270-1Reference document

Same NSN cross-reference

Reference document — Design control — primary reference

ROM/PROM FAMILY 013Reference document

Same NSN cross-reference

Reference document — Secondary reference

M38510/20702BEBReference document

Same NSN cross-reference

Reference document — Secondary reference

HM7603Reference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Terminal item — no further procurement; issued until stock is exhaustedDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is 1816-1270?

1816-1270 is a MICROCIRCUIT,MEMORY.

What parts can replace 1816-1270?

There are 4 known substitutes for 1816-1270: A-1816-1270-1, ROM/PROM FAMILY 013, M38510/20702BEB and 1 more. Substitute compatibility should be verified for your specific system.

What is the NSN for 1816-1270?

1816-1270 is cataloged in the U.S. Government catalog under NSN 5962-01-095-2374. This indicates validated use in U.S. government and defense supply chains.

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