1816-1054: MICROCIRCUIT,MEMORY.
The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.310 INCHES MAXIMUM IN, body_height: 0.120 INCHES MAXIMUM IN, body_length: 0.930 INCHES MAXIMUM IN, memory_capacity: UNKNOWN, special_features: GLASS FRIT SEAL, features_provided: HERMETICALLY SEALED AND MONOLITHIC AND 3-STATE OUTPUT AND W/STORAGE AND BIPOLAR AND SCHOTTKY. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-082-4390, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.310 INCHES MAXIMUM IN |
| body_height | 0.120 INCHES MAXIMUM IN |
| body_length | 0.930 INCHES MAXIMUM IN |
| memory_capacity | UNKNOWN |
| special_features | GLASS FRIT SEAL |
| features_provided | HERMETICALLY SEALED AND MONOLITHIC AND 3-STATE OUTPUT AND W/STORAGE AND BIPOLAR AND SCHOTTKY |
| output_logic_form | TRANSISTOR-TRANSISTOR LOGIC |
| inclosure_material | CERAMIC |
| memory_device_type | ROM |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| operating_temp_range | +0.0 TO 70.0 CELSIUS DEGC |
| input_circuit_pattern | 12 INPUT |
| NSN | 5962-01-082-4390 |
| INPUT CIRCUIT PATTERN | 12 INPUT |
| INCLOSURE MATERIAL | CERAMIC |
| BODY WIDTH | 0.310 INCHES MAXIMUM IN |
| BODY HEIGHT | 0.120 INCHES MAXIMUM IN |
| FEATURES PROVIDED | HERMETICALLY SEALED AND MONOLITHIC AND 3-STATE OUTPUT AND W/STORAGE AND BIPOLAR AND SCHOTTKY |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| MEMORY DEVICE TYPE | ROM |
| BODY LENGTH | 0.930 INCHES MAXIMUM IN |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS DEGC |
| OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |