1816-1019 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

1816-1019: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.560 INCHES NOMINAL IN, body_height: 0.180 INCHES MAXIMUM IN, body_length: 1.290 INCHES MAXIMUM IN, overall_width: 0.590 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN, overall_height: 0.325 INCHES NOMINAL IN, features_provided: BURN IN AND PROGRAMMED. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-347-9404, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

1816-1019

NSN: 5962-01-347-9404
FSC: 5962 — Microcircuits, Electronic
CAGE: 28240 — TRIDENT ELECTRONICS INC (USA)

SPECIFICATIONS

body_width	0.560 INCHES NOMINAL IN
body_height	0.180 INCHES MAXIMUM IN
body_length	1.290 INCHES MAXIMUM IN
overall_width	0.590 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN
overall_height	0.325 INCHES NOMINAL IN
features_provided	BURN IN AND PROGRAMMED
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	PLASTIC
memory_device_type	PROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
end_item_identification	6625-01-138-0361
NSN	5962-01-347-9404

COMPONENT DIAGRAM

KEY FEATURES

•

INCLOSURE MATERIAL: PLASTIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.560 INCHES NOMINAL IN

•

BODY HEIGHT: 0.180 INCHES MAXIMUM IN

•

FEATURES PROVIDED: BURN IN AND PROGRAMMED

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

OVERALL HEIGHT	0.325 INCHES NOMINAL IN
INCLOSURE MATERIAL	PLASTIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.560 INCHES NOMINAL IN
BODY HEIGHT	0.180 INCHES MAXIMUM IN
OVERALL WIDTH	0.590 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN
FEATURES PROVIDED	BURN IN AND PROGRAMMED
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	PROM
BODY LENGTH	1.290 INCHES MAXIMUM IN

OTHER ITEMS IN FSC 5962 — Microcircuits, Electronic

Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.

5962-00-001-1861 5962-00-001-1901 5962-00-001-1902 5962-00-001-1905 5962-00-001-1906 5962-00-001-1907 5962-00-001-1908 5962-00-001-1909

SUBSTITUTES & CROSS-REFERENCES 2

ROM/PROM FAMILY 005Reference document

Same NSN cross-reference

Reference document — Secondary reference

05345-80021Reference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Terminal item — no further procurement; issued until stock is exhaustedDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is 1816-1019?

1816-1019 is a MICROCIRCUIT,MEMORY.

What parts can replace 1816-1019?

There are 2 known substitutes for 1816-1019: ROM/PROM FAMILY 005, 05345-80021. Substitute compatibility should be verified for your specific system.

What is the NSN for 1816-1019?

1816-1019 is cataloged in the U.S. Government catalog under NSN 5962-01-347-9404. This indicates validated use in U.S. government and defense supply chains.

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