1816-0921 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

1816-0921: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.560 INCHES MAXIMUM IN, body_height: 0.200 INCHES MAXIMUM IN, body_length: 1.235 INCHES MINIMUM AND 1.290 INCHES MAXIMUM IN, memory_capacity: UNKNOWN, features_provided: BIPOLAR AND 3-STATE OUTPUT AND PROGRAMMED AND W/STROBE AND W/ENABLE, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-145-3258, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

1816-0921

NSN: 5962-01-145-3258
FSC: 5962 — Microcircuits, Electronic
CAGE: 7ZXR5 — KEYSIGHT TECHNOLOGIES INC (USA)

SPECIFICATIONS

body_width	0.560 INCHES MAXIMUM IN
body_height	0.200 INCHES MAXIMUM IN
body_length	1.235 INCHES MINIMUM AND 1.290 INCHES MAXIMUM IN
memory_capacity	UNKNOWN
features_provided	BIPOLAR AND 3-STATE OUTPUT AND PROGRAMMED AND W/STROBE AND W/ENABLE
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC AND GLASS
memory_device_type	ROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	+0.0 TO 75.0 CELSIUS DEGC
input_circuit_pattern	12 INPUT
end_item_identification	4920-01-049-0223 88818
NSN	5962-01-145-3258

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 12 INPUT

•

INCLOSURE MATERIAL: CERAMIC AND GLASS

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.560 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.200 INCHES MAXIMUM IN

•

FEATURES PROVIDED: BIPOLAR AND 3-STATE OUTPUT AND PROGRAMMED AND W/STROBE AND W/ENABLE

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: ROM

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	12 INPUT
INCLOSURE MATERIAL	CERAMIC AND GLASS
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.560 INCHES MAXIMUM IN
BODY HEIGHT	0.200 INCHES MAXIMUM IN
FEATURES PROVIDED	BIPOLAR AND 3-STATE OUTPUT AND PROGRAMMED AND W/STROBE AND W/ENABLE
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	ROM
BODY LENGTH	1.235 INCHES MINIMUM AND 1.290 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC

SUBSTITUTES & CROSS-REFERENCES 1

N82S115FReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is 1816-0921?

1816-0921 is a MICROCIRCUIT,MEMORY.

What parts can replace 1816-0921?

There is 1 known substitute for 1816-0921: N82S115F. Substitute compatibility should be verified for your specific system.

What is the NSN for 1816-0921?

1816-0921 is cataloged in the U.S. Government catalog under NSN 5962-01-145-3258. This indicates validated use in U.S. government and defense supply chains.

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