171322-01 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

171322-01: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.442 INCHES MINIMUM AND 0.458 INCHES MAXIMUM IN, body_height: 0.060 INCHES MINIMUM AND 0.120 INCHES MAXIMUM IN, body_length: 0.540 INCHES MINIMUM AND 0.560 INCHES MAXIMUM IN, special_features: NUCLEAR HARDNESS CRITICAL ITEM, features_provided: ELECTROSTATIC SENSITIVE AND LOW POWER AND STATIC OPERATION AND BIDIRECTIONAL AND HIGH IMPEDANCE, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-415-9725, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

171322-01

NSN: 5962-01-415-9725
FSC: 5962 — Microcircuits, Electronic
CAGE: 35351 — GE AVIATION SYSTEMS LLC (USA)

SPECIFICATIONS

body_width	0.442 INCHES MINIMUM AND 0.458 INCHES MAXIMUM IN
body_height	0.060 INCHES MINIMUM AND 0.120 INCHES MAXIMUM IN
body_length	0.540 INCHES MINIMUM AND 0.560 INCHES MAXIMUM IN
special_features	NUCLEAR HARDNESS CRITICAL ITEM
features_provided	ELECTROSTATIC SENSITIVE AND LOW POWER AND STATIC OPERATION AND BIDIRECTIONAL AND HIGH IMPEDANCE
output_logic_form	COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	RAM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
end_item_identification	B-2 BOMBER, INSTRUMENT SUPPORT EQUIPMENT
NSN	5962-01-415-9725

COMPONENT DIAGRAM

KEY FEATURES

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.442 INCHES MINIMUM AND 0.458 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.060 INCHES MINIMUM AND 0.120 INCHES MAXIMUM IN

•

CRITICALITY CODE JUSTIFICATION: FEAT

•

FEATURES PROVIDED: ELECTROSTATIC SENSITIVE AND LOW POWER AND STATIC OPERATION AND BIDIRECTIONAL AND HIGH IMPEDANCE

•

INCLOSURE CONFIGURATION: LEADED CHIP CARRIER

•

MEMORY DEVICE TYPE: RAM

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.442 INCHES MINIMUM AND 0.458 INCHES MAXIMUM IN
BODY HEIGHT	0.060 INCHES MINIMUM AND 0.120 INCHES MAXIMUM IN
CRITICALITY CODE JUSTIFICATION	FEAT
FEATURES PROVIDED	ELECTROSTATIC SENSITIVE AND LOW POWER AND STATIC OPERATION AND BIDIRECTIONAL AND HIGH IMPEDANCE
INCLOSURE CONFIGURATION	LEADED CHIP CARRIER
MEMORY DEVICE TYPE	RAM
BODY LENGTH	0.540 INCHES MINIMUM AND 0.560 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC

SUBSTITUTES & CROSS-REFERENCES 2

NH171322-01Reference document

Same NSN cross-reference

Reference document — Secondary reference

5962-8855202YAReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation + specific procedure

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FREQUENTLY ASKED QUESTIONS

What is 171322-01?

171322-01 is a MICROCIRCUIT,MEMORY.

What parts can replace 171322-01?

There are 2 known substitutes for 171322-01: NH171322-01, 5962-8855202YA. Substitute compatibility should be verified for your specific system.

What is the NSN for 171322-01?

171322-01 is cataloged in the U.S. Government catalog under NSN 5962-01-415-9725. This indicates validated use in U.S. government and defense supply chains.

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171322-01 — MICROCIRCUIT,MEMORY

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