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Technical Data Sheet
PartsTable / COMPONENT / 170218-03
170218-03 ✓ Verified by PartsTable
— · COMPONENT
WHAT YOU NEED TO KNOW
Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel
Confirm exact part number — similar PNs may be different parts
PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN, body_height: 0.217 INCHES MAXIMUM IN, body_length: 1.490 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND PROGRAMMED AND ULTRAVIOLET ERASABLE AND ELECTROSTATIC SENSITIVE, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-362-1139, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
170218-03
NSN: 5962-01-362-1139
FSC: 5962
CAGE: 35351 — GE AVIATION SYSTEMS LLC (USA)
SPECIFICATIONS
body_width0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN
body_height0.217 INCHES MAXIMUM IN
body_length1.490 INCHES MAXIMUM IN
features_providedHERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND PROGRAMMED AND ULTRAVIOLET ERASABLE AND ELECTROSTATIC SENSITIVE
output_logic_formCOMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_materialCERAMIC
memory_device_typePROM
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
test_data_document96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern25 INPUT
inclosure_configurationDUAL-IN-LINE
NSN5962-01-362-1139
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN 170218-03 MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
MAXIMUM POWER DISSIPATION RATING: 500.0 MILLIWATTS
•
OPERATING TEMP RANGE: -55.0 TO 125.0 CELSIUS DEGC
•
BODY LENGTH: 1.490 INCHES MAXIMUM IN
•
TERMINAL SURFACE TREATMENT: SOLDER
•
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 5.5 VOLTS MAXIMUM POWER SOURCE
•
TIME RATING PER CHACTERISTIC: 250.00 NANOSECONDS MAXIMUM ACCESS NS
•
TERMINAL TYPE AND QUANTITY: 28 PRINTED CIRCUIT
•
CASE OUTLINE SOURCE AND DESIGNATOR: D-10 MIL-M-38510
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS (FLIS)
MAXIMUM POWER DISSIPATION RATING500.0 MILLIWATTS
OPERATING TEMP RANGE-55.0 TO 125.0 CELSIUS DEGC
BODY LENGTH1.490 INCHES MAXIMUM IN
TERMINAL SURFACE TREATMENTSOLDER
VOLTAGE RATING AND TYPE PER CHARACTERISTIC5.5 VOLTS MAXIMUM POWER SOURCE
TIME RATING PER CHACTERISTIC250.00 NANOSECONDS MAXIMUM ACCESS NS
TERMINAL TYPE AND QUANTITY28 PRINTED CIRCUIT
CASE OUTLINE SOURCE AND DESIGNATORD-10 MIL-M-38510
TEST DATA DOCUMENT96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
MEMORY DEVICE TYPEPROM
VERIFIED SUBSTITUTES & CROSS-REFERENCES 16
10328209Interchangeable
interchangeable cross-reference
interchangeable
AM27C256-250/BXAInterchangeable
interchangeable cross-reference
interchangeable
SM27C256-25JMInterchangeable
interchangeable cross-reference
interchangeable
ROM/PROM FAMILY 127Interchangeable
interchangeable cross-reference
interchangeable
5962-8606302XAInterchangeable
interchangeable cross-reference
interchangeable
312A5263P3Interchangeable
interchangeable cross-reference
interchangeable
LIFECYCLE
StatusACTIVE
AvailabilityOEM and secondary market
RoHS CompliantEAR99ESD SensitiveNot HAZMAT
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FREQUENTLY ASKED QUESTIONS
What is 170218-03?
170218-03 is a MICROCIRCUIT,MEMORY.
What parts can replace 170218-03?
There are 16 known substitutes for 170218-03: 10328209, AM27C256-250/BXA, SM27C256-25JM and 13 more. Substitute compatibility should be verified for your specific system.
What is the NSN for 170218-03?
170218-03 is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-362-1139. This indicates validated use in U.S. government and defense supply chains.
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PartsTable Design LLC · partstable.com
Last verified: July 2026