170208-01 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

170208-01: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include features_provided: ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND MONOLITHIC AND 3-STATE OUTPUT AND LOW POWER, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC, memory_device_type: RAM, storage_temp_range: -65.0 TO 150.0 CELSIUS DEGC, operating_temp_range: -55.0 TO 125.0 CELSIUS DEGC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-421-1336, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

170208-01

NSN: 5962-01-421-1336
FSC: 5962 — Microcircuits, Electronic
CAGE: 35351 — GE AVIATION SYSTEMS LLC (USA)

SPECIFICATIONS

features_provided	ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND MONOLITHIC AND 3-STATE OUTPUT AND LOW POWER
output_logic_form	COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	RAM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
inclosure_configuration	LEADED CHIP CARRIER
terminal_surface_treatment	SOLDER
terminal_type_and_quantity	32 LEADLESS
time_rating_per_chacteristic	150.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 150.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS
maximum_power_dissipation_rating	495.0 MILLIWATTS
nuclear_hardness_critical_feature	HARDENED
NSN	5962-01-421-1336

COMPONENT DIAGRAM

KEY FEATURES

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

FEATURES PROVIDED: ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND MONOLITHIC AND 3-STATE OUTPUT AND LOW POWER

•

INCLOSURE CONFIGURATION: LEADED CHIP CARRIER

•

MEMORY DEVICE TYPE: RAM

•

STORAGE TEMP RANGE: -65.0 TO 150.0 CELSIUS DEGC

•

OUTPUT LOGIC FORM: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC

•

VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 7.0 VOLTS MAXIMUM POWER SOURCE

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
FEATURES PROVIDED	ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND MONOLITHIC AND 3-STATE OUTPUT AND LOW POWER
INCLOSURE CONFIGURATION	LEADED CHIP CARRIER
MEMORY DEVICE TYPE	RAM
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC
OUTPUT LOGIC FORM	COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
VOLTAGE RATING AND TYPE PER CHARACTERISTIC	7.0 VOLTS MAXIMUM POWER SOURCE
OPERATING TEMP RANGE	-55.0 TO 125.0 CELSIUS DEGC
TERMINAL TYPE AND QUANTITY	32 LEADLESS

SUBSTITUTES & CROSS-REFERENCES 1

MB8464-15CV-W-SCReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation + specific procedure

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FREQUENTLY ASKED QUESTIONS

What is 170208-01?

170208-01 is a MICROCIRCUIT,MEMORY.

What parts can replace 170208-01?

There is 1 known substitute for 170208-01: MB8464-15CV-W-SC. Substitute compatibility should be verified for your specific system.

What is the NSN for 170208-01?

170208-01 is cataloged in the U.S. Government catalog under NSN 5962-01-421-1336. This indicates validated use in U.S. government and defense supply chains.

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