1700186-501 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

1700186-501: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.250 INCHES NOMINAL IN, body_length: 0.330 INCHES NOMINAL IN, inclosure_material: PLASTIC, memory_device_type: PROM, operating_temp_range: +0.0 TO 70.0 CELSIUS DEGC, end_item_identification: SCOPE SHIELD E/I FSCM 23386. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-450-5953, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

1700186-501

NSN: 5962-01-450-5953
FSC: 5962 — Microcircuits, Electronic
CAGE: 23386 — THALES DEFENSE & SECURITY INC DBA THALES COMMUNICATIONS INC (USA)

SPECIFICATIONS

body_width	0.250 INCHES NOMINAL IN
body_length	0.330 INCHES NOMINAL IN
inclosure_material	PLASTIC
memory_device_type	PROM
operating_temp_range	+0.0 TO 70.0 CELSIUS DEGC
end_item_identification	SCOPE SHIELD E/I FSCM 23386
inclosure_configuration	LEADLESS FLAT PACK
terminal_type_and_quantity	20 LEADLESS
voltage_rating_and_type_per_characteristic	3.3 VOLTS MAXIMUM APPLIED
NSN	5962-01-450-5953

COMPONENT DIAGRAM

KEY FEATURES

•

INCLOSURE MATERIAL: PLASTIC

•

BODY WIDTH: 0.250 INCHES NOMINAL IN

•

INCLOSURE CONFIGURATION: LEADLESS FLAT PACK

•

MEMORY DEVICE TYPE: PROM

•

BODY LENGTH: 0.330 INCHES NOMINAL IN

•

VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 3.3 VOLTS MAXIMUM APPLIED

•

OPERATING TEMP RANGE: +0.0 TO 70.0 CELSIUS DEGC

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INCLOSURE MATERIAL	PLASTIC
BODY WIDTH	0.250 INCHES NOMINAL IN
INCLOSURE CONFIGURATION	LEADLESS FLAT PACK
MEMORY DEVICE TYPE	PROM
BODY LENGTH	0.330 INCHES NOMINAL IN
VOLTAGE RATING AND TYPE PER CHARACTERISTIC	3.3 VOLTS MAXIMUM APPLIED
OPERATING TEMP RANGE	+0.0 TO 70.0 CELSIUS DEGC
END ITEM IDENTIFICATION	SCOPE SHIELD E/I FSCM 23386
TERMINAL TYPE AND QUANTITY	20 LEADLESS

OTHER ITEMS IN FSC 5962 — Microcircuits, Electronic

Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.

5962-00-001-1861 5962-00-001-1901 5962-00-001-1902 5962-00-001-1905 5962-00-001-1906 5962-00-001-1907 5962-00-001-1908 5962-00-001-1909

SUBSTITUTES & CROSS-REFERENCES 2

ROM/PROMReference document

Same NSN cross-reference

Reference document — Secondary reference

EPC1064VReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation + specific procedure

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FREQUENTLY ASKED QUESTIONS

What is 1700186-501?

1700186-501 is a MICROCIRCUIT,MEMORY.

What parts can replace 1700186-501?

There are 2 known substitutes for 1700186-501: ROM/PROM, EPC1064V. Substitute compatibility should be verified for your specific system.

What is the NSN for 1700186-501?

1700186-501 is cataloged in the U.S. Government catalog under NSN 5962-01-450-5953. This indicates validated use in U.S. government and defense supply chains.

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