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168545-07 — MICROCIRCUIT,MEMORY

✓ Government record, cited
— · COMPONENT
PRODUCT OVERVIEW

168545-07: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include features_provided: BURN IN AND ELECTROSTATIC SENSITIVE AND PROGRAMMED, inclosure_material: CERAMIC, memory_device_type: PAL, storage_temp_range: -65.0 TO 150.0 CELSIUS DEGC, test_data_document: 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.)., operating_temp_range: -55.0 TO 125.0 CELSIUS DEGC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-370-5498, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
168545-07
NSN: 5962-01-370-5498
FSC: 5962 — Microcircuits, Electronic
CAGE: 35351 — GE AVIATION SYSTEMS LLC (USA)
SPECIFICATIONS
features_providedBURN IN AND ELECTROSTATIC SENSITIVE AND PROGRAMMED
inclosure_materialCERAMIC
memory_device_typePAL
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
test_data_document96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern16 INPUT
inclosure_configurationLEADLESS FLAT PACK
terminal_surface_treatmentSOLDER
terminal_type_and_quantity20 LEADLESS
voltage_rating_and_type_per_characteristic7.0 VOLTS MAXIMUM POWER SOURCE
NSN5962-01-370-5498
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN 168545-07 MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
INPUT CIRCUIT PATTERN: 16 INPUT
•
INCLOSURE MATERIAL: CERAMIC
•
TERMINAL SURFACE TREATMENT: SOLDER
•
FEATURES PROVIDED: BURN IN AND ELECTROSTATIC SENSITIVE AND PROGRAMMED
•
INCLOSURE CONFIGURATION: LEADLESS FLAT PACK
•
MEMORY DEVICE TYPE: PAL
•
STORAGE TEMP RANGE: -65.0 TO 150.0 CELSIUS DEGC
•
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 7.0 VOLTS MAXIMUM POWER SOURCE
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS
INPUT CIRCUIT PATTERN16 INPUT
INCLOSURE MATERIALCERAMIC
TERMINAL SURFACE TREATMENTSOLDER
FEATURES PROVIDEDBURN IN AND ELECTROSTATIC SENSITIVE AND PROGRAMMED
INCLOSURE CONFIGURATIONLEADLESS FLAT PACK
MEMORY DEVICE TYPEPAL
STORAGE TEMP RANGE-65.0 TO 150.0 CELSIUS DEGC
VOLTAGE RATING AND TYPE PER CHARACTERISTIC7.0 VOLTS MAXIMUM POWER SOURCE
OPERATING TEMP RANGE-55.0 TO 125.0 CELSIUS DEGC
TEST DATA DOCUMENT96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
SUBSTITUTES & CROSS-REFERENCES 2
ROM/PROMReference document
Same NSN cross-reference
Reference document — Secondary reference
M38510/50410B2AReference document
Same NSN cross-reference
Reference document — Secondary reference
LIFECYCLE
NSN statusActive· U.S. Government catalog
Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)
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FREQUENTLY ASKED QUESTIONS
What is 168545-07?
168545-07 is a MICROCIRCUIT,MEMORY.
What parts can replace 168545-07?
There are 2 known substitutes for 168545-07: ROM/PROM, M38510/50410B2A. Substitute compatibility should be verified for your specific system.
What is the NSN for 168545-07?
168545-07 is cataloged in the U.S. Government catalog under NSN 5962-01-370-5498. This indicates validated use in U.S. government and defense supply chains.
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