The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include features_provided: HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND MONOLITHIC AND BIPOLAR AND ELECTROSTATIC SENSITIVE, inclosure_material: CERAMIC, test_data_document: 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.)., input_circuit_pattern: 20 INPUT, inclosure_configuration: LEADLESS FLAT PACK, terminal_surface_treatment: SOLDER. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-299-6397, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| features_provided | HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND MONOLITHIC AND BIPOLAR AND ELECTROSTATIC SENSITIVE |
| inclosure_material | CERAMIC |
| test_data_document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| input_circuit_pattern | 20 INPUT |
| inclosure_configuration | LEADLESS FLAT PACK |
| terminal_surface_treatment | SOLDER |
| design_function_and_quantity | 1 GATE, ARRAY |
| NSN | 5962-01-299-6397 |
| INPUT CIRCUIT PATTERN | 20 INPUT |
| TERMINAL SURFACE TREATMENT | SOLDER |
| INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
| INCLOSURE MATERIAL | CERAMIC |
| DESIGN FUNCTION AND QUANTITY | 1 GATE, ARRAY |
| TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND MONOLITHIC AND BIPOLAR AND ELECTROSTATIC SENSITIVE |