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Technical Data Sheet
PartsTable / COMPONENT / 167669-03
167669-03 ✓ Verified by PartsTable
— · COMPONENT
WHAT YOU NEED TO KNOW
Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel
Confirm exact part number — similar PNs may be different parts
PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN, body_height: 0.185 INCHES MAXIMUM IN, body_length: 1.060 INCHES MAXIMUM IN, features_provided: BIPOLAR AND PROGRAMMED AND HIGH IMPEDANCE AND W/CLOCK AND BIDIRECTIONAL AND ELECTROSTATIC SENSITIVE, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-370-8093, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
167669-03
NSN: 5962-01-370-8093
FSC: 5962
CAGE: 35351 — GE AVIATION SYSTEMS LLC (USA)
SPECIFICATIONS
body_width0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
body_height0.185 INCHES MAXIMUM IN
body_length1.060 INCHES MAXIMUM IN
features_providedBIPOLAR AND PROGRAMMED AND HIGH IMPEDANCE AND W/CLOCK AND BIDIRECTIONAL AND ELECTROSTATIC SENSITIVE
output_logic_formTRANSISTOR-TRANSISTOR LOGIC
inclosure_materialCERAMIC
memory_device_typePAL
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
test_data_document96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern14 INPUT
end_item_identification5895-01-305-8863 RECORDER,SIGNAL DATA
NSN5962-01-370-8093
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN 167669-03 MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
BODY HEIGHT: 0.185 INCHES MAXIMUM IN
•
STORAGE TEMP RANGE: -65.0 TO 150.0 CELSIUS DEGC
•
BODY LENGTH: 1.060 INCHES MAXIMUM IN
•
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: -0.5 VOLTS MINIMUM POWER SOURCE AND 12.0 VOLTS MAXIMUM POWER SOURCE
•
BODY WIDTH: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
•
TEST DATA DOCUMENT: 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
•
TERMINAL SURFACE TREATMENT: SOLDER
•
INCLOSURE CONFIGURATION: DUAL-IN-LINE
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS (FLIS)
BODY HEIGHT0.185 INCHES MAXIMUM IN
STORAGE TEMP RANGE-65.0 TO 150.0 CELSIUS DEGC
BODY LENGTH1.060 INCHES MAXIMUM IN
VOLTAGE RATING AND TYPE PER CHARACTERISTIC-0.5 VOLTS MINIMUM POWER SOURCE AND 12.0 VOLTS MAXIMUM POWER SOURCE
BODY WIDTH0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
TEST DATA DOCUMENT96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
TERMINAL SURFACE TREATMENTSOLDER
INCLOSURE CONFIGURATIONDUAL-IN-LINE
MAXIMUM POWER DISSIPATION RATING1.1 WATTS
INPUT CIRCUIT PATTERN14 INPUT
VERIFIED SUBSTITUTES & CROSS-REFERENCES 20
ROM/PROM FAMILY 151Interchangeable
interchangeable cross-reference
interchangeable
7567131-001Interchangeable
interchangeable cross-reference
interchangeable
7140109-00Interchangeable
interchangeable cross-reference
interchangeable
M38510/50410BRAInterchangeable
interchangeable cross-reference
interchangeable
PAL16R4A-2MJ/883BInterchangeable
interchangeable cross-reference
interchangeable
8103614RBInterchangeable
interchangeable cross-reference
interchangeable
LIFECYCLE
StatusACTIVE
AvailabilityOEM and secondary market
RoHS CompliantEAR99ESD SensitiveNot HAZMAT
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FREQUENTLY ASKED QUESTIONS
What is 167669-03?
167669-03 is a MICROCIRCUIT,MEMORY.
What parts can replace 167669-03?
There are 20 known substitutes for 167669-03: ROM/PROM FAMILY 151, 7567131-001, 7140109-00 and 17 more. Substitute compatibility should be verified for your specific system.
What is the NSN for 167669-03?
167669-03 is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-370-8093. This indicates validated use in U.S. government and defense supply chains.
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Last verified: July 2026