165-998-0 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

165-998-0: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 1.030 INCHES MAXIMUM IN, body_height: 0.200 INCHES MAXIMUM IN, body_length: 1.400 INCHES MAXIMUM IN, features_provided: HYBRID AND MULTICHIP AND POSITIVE OUTPUTS, inclosure_material: RESIN, memory_device_type: ROM. This part is cataloged in the U.S.

Government catalog under NSN 5962-00-588-9607, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

165-998-0

NSN: 5962-00-588-9607
FSC: 5962 — Microcircuits, Electronic
CAGE: 73138 — BI TECHNOLOGIES CORPORATION DIV BI TECHNOLOGIES CORP. (USA)

SPECIFICATIONS

body_width	1.030 INCHES MAXIMUM IN
body_height	0.200 INCHES MAXIMUM IN
body_length	1.400 INCHES MAXIMUM IN
features_provided	HYBRID AND MULTICHIP AND POSITIVE OUTPUTS
inclosure_material	RESIN
memory_device_type	ROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	9 INPUT
end_item_identification	TYPE F-TF-F15A AIRCRAFT
inclosure_configuration	DUAL-IN-LINE
terminal_surface_treatment	SOLDER
NSN	5962-00-588-9607

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 9 INPUT

•

INCLOSURE MATERIAL: RESIN

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 1.030 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.200 INCHES MAXIMUM IN

•

FEATURES PROVIDED: HYBRID AND MULTICHIP AND POSITIVE OUTPUTS

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: ROM

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	9 INPUT
INCLOSURE MATERIAL	RESIN
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	1.030 INCHES MAXIMUM IN
BODY HEIGHT	0.200 INCHES MAXIMUM IN
FEATURES PROVIDED	HYBRID AND MULTICHIP AND POSITIVE OUTPUTS
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	ROM
BODY LENGTH	1.400 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC

OTHER ITEMS IN FSC 5962 — Microcircuits, Electronic

Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.

5962-00-001-1861 5962-00-001-1901 5962-00-001-1902 5962-00-001-1905 5962-00-001-1906 5962-00-001-1907 5962-00-001-1908 5962-00-001-1909

SUBSTITUTES & CROSS-REFERENCES 3

4130013-1Reference document

Same NSN cross-reference

Reference document — Design control — primary reference

098-9000-001Reference document

Same NSN cross-reference

Reference document — Secondary reference

635Reference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Demilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is 165-998-0?

165-998-0 is a MICROCIRCUIT,MEMORY.

What parts can replace 165-998-0?

There are 3 known substitutes for 165-998-0: 4130013-1, 098-9000-001, 635. Substitute compatibility should be verified for your specific system.

What is the NSN for 165-998-0?

165-998-0 is cataloged in the U.S. Government catalog under NSN 5962-00-588-9607. This indicates validated use in U.S. government and defense supply chains.

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