163973: TELETYPEWRITER SUBASSEMBLY.
The TELETYPEWRITER SUBASSEMBLY is a the manufacturer industrial component. Key specifications include width: 2.000 INCHES IN, body_length: 0.165 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN, fiber_material: POLYESTER, features_provided: MONOLITHIC, inclosure_material: SILICON, operating_temp_range: -55.0 TO 125.0 CELSIUS DEGC. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-043-8326, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| width | 2.000 INCHES IN |
| body_length | 0.165 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN |
| fiber_material | POLYESTER |
| special_features | FASTENER TAPE, VELCRO HOOK W/SPECTRUM PLUS ADHESIVE BACKING; WOVEN WITH 1/16 INCH SELVAGE ON EACH EDGE; 8.0 MIL POLYESTER MONOFILAMENT WITH OVER 240 HOOKS PER SQ. IN. IN |
| features_provided | MONOLITHIC |
| inclosure_material | SILICON |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| body_outside_diameter | 0.305 INCHES MINIMUM AND 0.335 INCHES MAXIMUM IN |
| input_circuit_pattern | 2 INPUT |
| inclosure_configuration | CAN |
| terminal_surface_treatment | SOLDER |
| specification/standard_data | 81349-MIL-M-38510/101 GOVERNMENT SPECIFICATION |
| NSN | 5962-01-043-8326 |
| INPUT CIRCUIT PATTERN | 2 INPUT |
| INCLOSURE MATERIAL | SILICON |
| TERMINAL SURFACE TREATMENT | SOLDER |
| BODY OUTSIDE DIAMETER | 0.305 INCHES MINIMUM AND 0.335 INCHES MAXIMUM IN |
| DESIGN FUNCTION AND QUANTITY | 1 AMPLIFIER, OPERATIONAL, GENERAL PURPOSE |
| FEATURES PROVIDED | MONOLITHIC |
| INCLOSURE CONFIGURATION | CAN |
| SPECIFICATION/STANDARD DATA | 81349-MIL-M-38510/101 GOVERNMENT SPECIFICATION |
| BODY LENGTH | 0.165 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN |
| OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS DEGC |