The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include material: ALUMINUM BODY, body_width: 0.310 INCHES MAXIMUM IN, body_height: 0.185 INCHES MAXIMUM IN, body_length: 1.060 INCHES MAXIMUM IN, mounting_method: PANEL, style_designator: ROUND FRAME, ROUND LENS TYPE. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 6210-00-084-4945, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| material | ALUMINUM BODY |
| body_width | 0.310 INCHES MAXIMUM IN |
| body_height | 0.185 INCHES MAXIMUM IN |
| body_length | 1.060 INCHES MAXIMUM IN |
| mounting_method | PANEL |
| style_designator | ROUND FRAME, ROUND LENS TYPE |
| features_provided | MONOLITHIC AND HERMETICALLY SEALED AND 3-STATE OUTPUT |
| output_logic_form | TRANSISTOR-TRANSISTOR LOGIC |
| inclosure_material | CERAMIC |
| memory_device_type | ROM |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| NSN | 6210-00-084-4945 |
| TERMINAL TYPE AND QUANTITY | 2 SOLDER LUG |
| FURNISHED ITEMS AND QUANTITY | 1 HEXAGON NUT AND 1 LOCK WASHER |
| STYLE DESIGNATOR | ROUND FRAME, ROUND LENS TYPE |
| MOUNTING METHOD | PANEL |
| MATERIAL | ALUMINUM BODY |