160700-03 — MICROCIRCUIT,DIGITAL

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

160700-03: MICROCIRCUIT,DIGITAL.

The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.662 INCHES MAXIMUM IN, body_height: 0.120 INCHES MAXIMUM IN, body_length: 0.662 INCHES MAXIMUM IN, features_provided: ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND BIDIRECTIONAL AND PARALLEL OPERATION, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-246-2931, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

160700-03

NSN: 5962-01-246-2931
FSC: 5962 — Microcircuits, Electronic
CAGE: 35351 — GE AVIATION SYSTEMS LLC (USA)

SPECIFICATIONS

body_width	0.662 INCHES MAXIMUM IN
body_height	0.120 INCHES MAXIMUM IN
body_length	0.662 INCHES MAXIMUM IN
features_provided	ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND BIDIRECTIONAL AND PARALLEL OPERATION
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	38 INPUT
inclosure_configuration	LEADLESS FLAT PACK
terminal_surface_treatment	SOLDER
NSN	5962-01-246-2931

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 38 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

DESIGN FUNCTION AND QUANTITY: 1 COUNTER

•

BODY WIDTH: 0.662 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.120 INCHES MAXIMUM IN

•

FEATURES PROVIDED: ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND BIDIRECTIONAL AND PARALLEL OPERATION

•

INCLOSURE CONFIGURATION: LEADLESS FLAT PACK

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	38 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
DESIGN FUNCTION AND QUANTITY	1 COUNTER
BODY WIDTH	0.662 INCHES MAXIMUM IN
BODY HEIGHT	0.120 INCHES MAXIMUM IN
FEATURES PROVIDED	ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND BIDIRECTIONAL AND PARALLEL OPERATION
INCLOSURE CONFIGURATION	LEADLESS FLAT PACK
CASE OUTLINE SOURCE AND DESIGNATOR	C-5 MIL-M-38510
BODY LENGTH	0.662 INCHES MAXIMUM IN

SUBSTITUTES & CROSS-REFERENCES 2

Z8036ALMBReference document

Same NSN cross-reference

Reference document — Secondary reference

Z0803606LMBSame NSN cross-reference

Same NSN cross-reference

Also cataloged under this NSN

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation + specific procedure

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FREQUENTLY ASKED QUESTIONS

What is 160700-03?

160700-03 is a MICROCIRCUIT,DIGITAL.

What parts can replace 160700-03?

There are 2 known substitutes for 160700-03: Z8036ALMB, Z0803606LMB. Substitute compatibility should be verified for your specific system.

What is the NSN for 160700-03?

160700-03 is cataloged in the U.S. Government catalog under NSN 5962-01-246-2931. This indicates validated use in U.S. government and defense supply chains.

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160700-03 — MICROCIRCUIT,DIGITAL

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