160699-84 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

160699-84: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include features_provided: PROGRAMMED AND ELECTROSTATIC SENSITIVE, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC, memory_device_type: ROM, operating_temp_range: -55.0 TO 125.0 CELSIUS DEGC, inclosure_configuration: LEADLESS FLAT PACK. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-421-4820, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

160699-84

NSN: 5962-01-421-4820
FSC: 5962 — Microcircuits, Electronic
CAGE: 35351 — GE AVIATION SYSTEMS LLC (USA)

SPECIFICATIONS

features_provided	PROGRAMMED AND ELECTROSTATIC SENSITIVE
output_logic_form	COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	ROM
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
inclosure_configuration	LEADLESS FLAT PACK
terminal_surface_treatment	SOLDER
terminal_type_and_quantity	32 LEADLESS
time_rating_per_chacteristic	120.00 NANOSECONDS MAXIMUM ACCESS NS
voltage_rating_and_type_per_characteristic	7.0 VOLTS NOMINAL POWER SOURCE
NSN	5962-01-421-4820

COMPONENT DIAGRAM

KEY FEATURES

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

FEATURES PROVIDED: PROGRAMMED AND ELECTROSTATIC SENSITIVE

•

INCLOSURE CONFIGURATION: LEADLESS FLAT PACK

•

MEMORY DEVICE TYPE: ROM

•

OUTPUT LOGIC FORM: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC

•

VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 7.0 VOLTS NOMINAL POWER SOURCE

•

OPERATING TEMP RANGE: -55.0 TO 125.0 CELSIUS DEGC

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
FEATURES PROVIDED	PROGRAMMED AND ELECTROSTATIC SENSITIVE
INCLOSURE CONFIGURATION	LEADLESS FLAT PACK
MEMORY DEVICE TYPE	ROM
OUTPUT LOGIC FORM	COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
VOLTAGE RATING AND TYPE PER CHARACTERISTIC	7.0 VOLTS NOMINAL POWER SOURCE
OPERATING TEMP RANGE	-55.0 TO 125.0 CELSIUS DEGC
TERMINAL TYPE AND QUANTITY	32 LEADLESS
TIME RATING PER CHACTERISTIC	120.00 NANOSECONDS MAXIMUM ACCESS NS

SUBSTITUTES & CROSS-REFERENCES 3

HM4-6616B-8Reference document

Same NSN cross-reference

Reference document — Secondary reference

ROM/PROMReference document

Same NSN cross-reference

Reference document — Secondary reference

160651-03Reference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation + specific procedure

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FREQUENTLY ASKED QUESTIONS

What is 160699-84?

160699-84 is a MICROCIRCUIT,MEMORY.

What parts can replace 160699-84?

There are 3 known substitutes for 160699-84: HM4-6616B-8, ROM/PROM, 160651-03. Substitute compatibility should be verified for your specific system.

What is the NSN for 160699-84?

160699-84 is cataloged in the U.S. Government catalog under NSN 5962-01-421-4820. This indicates validated use in U.S. government and defense supply chains.

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