160674-03 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

160674-03: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.458 INCHES MAXIMUM IN, body_height: 0.105 INCHES MAXIMUM IN, body_length: 0.560 INCHES MAXIMUM IN, bit_quantity: 65536, word_quantity: 8192, features_provided: ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND MONOLITHIC AND ERASABLE AND PROGRAMMABLE AND W/ENABLE. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-233-2299, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

160674-03

NSN: 5962-01-233-2299
FSC: 5962 — Microcircuits, Electronic
CAGE: 35351 — GE AVIATION SYSTEMS LLC (USA)

SPECIFICATIONS

body_width	0.458 INCHES MAXIMUM IN
body_height	0.105 INCHES MAXIMUM IN
body_length	0.560 INCHES MAXIMUM IN
bit_quantity	65536
word_quantity	8192
features_provided	ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND MONOLITHIC AND ERASABLE AND PROGRAMMABLE AND W/ENABLE
output_logic_form	N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	ROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
NSN	5962-01-233-2299

COMPONENT DIAGRAM

KEY FEATURES

•

BIT QUANTITY: 65536

•

INPUT CIRCUIT PATTERN: 24 INPUT

•

WORD QUANTITY: 8192

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.458 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.105 INCHES MAXIMUM IN

•

FEATURES PROVIDED: ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND MONOLITHIC AND ERASABLE AND PROGRAMMABLE AND W/ENABLE

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

BIT QUANTITY	65536
INPUT CIRCUIT PATTERN	24 INPUT
WORD QUANTITY	8192
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.458 INCHES MAXIMUM IN
BODY HEIGHT	0.105 INCHES MAXIMUM IN
FEATURES PROVIDED	ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND MONOLITHIC AND ERASABLE AND PROGRAMMABLE AND W/ENABLE
INCLOSURE CONFIGURATION	LEADLESS FLAT PACK
MEMORY DEVICE TYPE	ROM

OTHER ITEMS IN FSC 5962 — Microcircuits, Electronic

Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.

5962-00-001-1861 5962-00-001-1901 5962-00-001-1902 5962-00-001-1905 5962-00-001-1906 5962-00-001-1907 5962-00-001-1908 5962-00-001-1909

SUBSTITUTES & CROSS-REFERENCES 4

X2864AC6148Same NSN cross-reference

Same NSN cross-reference

Also cataloged under this NSN

MR2864A/B-35Reference document

Same NSN cross-reference

Reference document — Secondary reference

ROM/PROMReference document

Same NSN cross-reference

Reference document — Secondary reference

X2864AEMB-35/C6148Same NSN cross-reference

Same NSN cross-reference

Also cataloged under this NSN

LIFECYCLE

NSN statusActive· U.S. Government catalog

Demilitarization required — mutilation

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FREQUENTLY ASKED QUESTIONS

What is 160674-03?

160674-03 is a MICROCIRCUIT,MEMORY.

What parts can replace 160674-03?

There are 4 known substitutes for 160674-03: X2864AC6148, MR2864A/B-35, ROM/PROM and 1 more. Substitute compatibility should be verified for your specific system.

What is the NSN for 160674-03?

160674-03 is cataloged in the U.S. Government catalog under NSN 5962-01-233-2299. This indicates validated use in U.S. government and defense supply chains.

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