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PartsTable / COMPONENT / 160245-40
160245-40 ✓ Verified by PartsTable
— · COMPONENT
WHAT YOU NEED TO KNOW
Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel
Confirm exact part number — similar PNs may be different parts
PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include features_provided: BURN IN AND ELECTROSTATIC SENSITIVE AND PROGRAMMED, inclosure_material: CERAMIC, memory_device_type: PROM, storage_temp_range: -55.0 TO 125.0 CELSIUS DEGC, operating_temp_range: +0.0 TO 75.0 CELSIUS DEGC, inclosure_configuration: DUAL-IN-LINE. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-357-4215, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
160245-40
NSN: 5962-01-357-4215
FSC: 5962
CAGE: 35351 — GE AVIATION SYSTEMS LLC (USA)
SPECIFICATIONS
features_providedBURN IN AND ELECTROSTATIC SENSITIVE AND PROGRAMMED
inclosure_materialCERAMIC
memory_device_typePROM
storage_temp_range-55.0 TO 125.0 CELSIUS DEGC
operating_temp_range+0.0 TO 75.0 CELSIUS DEGC
inclosure_configurationDUAL-IN-LINE
NSN5962-01-357-4215
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN 160245-40 MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
MEMORY DEVICE TYPE: PROM
•
FEATURES PROVIDED: BURN IN AND ELECTROSTATIC SENSITIVE AND PROGRAMMED
•
STORAGE TEMP RANGE: -55.0 TO 125.0 CELSIUS DEGC
•
OPERATING TEMP RANGE: +0.0 TO 75.0 CELSIUS DEGC
•
INCLOSURE MATERIAL: CERAMIC
•
INCLOSURE CONFIGURATION: DUAL-IN-LINE
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS (FLIS)
MEMORY DEVICE TYPEPROM
FEATURES PROVIDEDBURN IN AND ELECTROSTATIC SENSITIVE AND PROGRAMMED
STORAGE TEMP RANGE-55.0 TO 125.0 CELSIUS DEGC
OPERATING TEMP RANGE+0.0 TO 75.0 CELSIUS DEGC
INCLOSURE MATERIALCERAMIC
INCLOSURE CONFIGURATIONDUAL-IN-LINE
VERIFIED SUBSTITUTES & CROSS-REFERENCES 16
M38510/21004BLBInterchangeable
interchangeable cross-reference
interchangeable
M38510/21004BLAInterchangeable
interchangeable cross-reference
interchangeable
5962-3821004BLXInterchangeable
interchangeable cross-reference
interchangeable
639739-04Interchangeable
interchangeable cross-reference
interchangeable
MM636739-04Interchangeable
interchangeable cross-reference
interchangeable
AM27S291A/BLAInterchangeable
interchangeable cross-reference
interchangeable
LIFECYCLE
StatusACTIVE
AvailabilityOEM and secondary market
RoHS CompliantEAR99ESD SensitiveNot HAZMAT
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FREQUENTLY ASKED QUESTIONS
What is 160245-40?
160245-40 is a MICROCIRCUIT,MEMORY.
What parts can replace 160245-40?
There are 16 known substitutes for 160245-40: M38510/21004BLB, M38510/21004BLA, 5962-3821004BLX and 13 more. Substitute compatibility should be verified for your specific system.
What is the NSN for 160245-40?
160245-40 is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-357-4215. This indicates validated use in U.S. government and defense supply chains.
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✓ Validated with multiple authoritative sources, including Government, OEM, and Certified sources.
PartsTable Design LLC · partstable.com
Last verified: July 2026