16-124240-1: SEMICONDUCTOR DEVICE SET.
The SEMICONDUCTOR DEVICE SET is a the manufacturer industrial component. Key specifications include material: GLASS ENCLOSURE ALL SEMICONDUCTOR DEVICE DIODE, overall_length: 0.230 INCHES MINIMUM AND 0.300 INCHES MAXIMUM ALL SEMICONDUCTOR DEVICE DIODE IN, mounting_method: TERMINAL ALL SEMICONDUCTOR DEVICE DIODE, terminal_length: 1.000 INCHES MINIMUM ALL SEMICONDUCTOR DEVICE DIODE IN, overall_diameter: 0.085 INCHES MINIMUM AND 0.107 INCHES MAXIMUM ALL SEMICONDUCTOR DEVICE DIODE IN, features_provided: HERMETICALLY SEALED CASE. This part is cataloged in the U.S.
Government catalog under NSN 5961-01-065-7903, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| material | GLASS ENCLOSURE ALL SEMICONDUCTOR DEVICE DIODE |
| overall_length | 0.230 INCHES MINIMUM AND 0.300 INCHES MAXIMUM ALL SEMICONDUCTOR DEVICE DIODE IN |
| mounting_method | TERMINAL ALL SEMICONDUCTOR DEVICE DIODE |
| terminal_length | 1.000 INCHES MINIMUM ALL SEMICONDUCTOR DEVICE DIODE IN |
| overall_diameter | 0.085 INCHES MINIMUM AND 0.107 INCHES MAXIMUM ALL SEMICONDUCTOR DEVICE DIODE IN |
| features_provided | HERMETICALLY SEALED CASE |
| terminal_type_and_quantity | 2 UNINSULATED WIRE LEAD ALL SEMICONDUCTOR DEVICE DIODE |
| component_name_and_quantity | 2 SEMICONDUCTOR DEVICE DIODE |
| component_function_relationship | MATCHED |
| joint_electronic_device_engineering_council/jedec/case_outline_designation | DO-7 ALL SEMICONDUCTOR DEVICE DIODE |
| NSN | 5961-01-065-7903 |
| JOINT ELECTRONIC DEVICE ENGINEERING COUNCIL/JEDEC/CASE OUTLINE DESIGNATION | DO-7 ALL SEMICONDUCTOR DEVICE DIODE |
| OVERALL DIAMETER | 0.085 INCHES MINIMUM AND 0.107 INCHES MAXIMUM ALL SEMICONDUCTOR DEVICE DIODE IN |
| TERMINAL LENGTH | 1.000 INCHES MINIMUM ALL SEMICONDUCTOR DEVICE DIODE IN |
| COMPONENT FUNCTION RELATIONSHIP | MATCHED |
| MOUNTING METHOD | TERMINAL ALL SEMICONDUCTOR DEVICE DIODE |
| OVERALL LENGTH | 0.230 INCHES MINIMUM AND 0.300 INCHES MAXIMUM ALL SEMICONDUCTOR DEVICE DIODE IN |
| COMPONENT NAME AND QUANTITY | 2 SEMICONDUCTOR DEVICE DIODE |
| FEATURES PROVIDED | HERMETICALLY SEALED CASE |
| MATERIAL | GLASS ENCLOSURE ALL SEMICONDUCTOR DEVICE DIODE |
| TERMINAL TYPE AND QUANTITY | 2 UNINSULATED WIRE LEAD ALL SEMICONDUCTOR DEVICE DIODE |
No substitute or cross-reference records for this part.