1578519: AMPLIFIER SUBASSEMBLY.
The AMPLIFIER SUBASSEMBLY is a RAYTHEON COMPANY DIV RMD STRATEGIC industrial component. Key specifications include OVERALL WIDTH: 5.000 INCHES NOMINAL IN, OVERALL HEIGHT: 0.787 INCHES NOMINAL IN, OVERALL LENGTH: 10.937 INCHES NOMINAL IN, MOUNTING CONFIGURATION: SIX 0.187 IN. DIA MTG HOLES,TWO ROWS OF 3 EA,0.450 IN.
BETWEEN ROWS,5.125 IN. C TO C WITHIN ROWS IN. This part is cataloged in the U.S.
Government catalog under NSN 5996-00-007-1375, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| OVERALL WIDTH | 5.000 INCHES NOMINAL IN |
| OVERALL HEIGHT | 0.787 INCHES NOMINAL IN |
| OVERALL LENGTH | 10.937 INCHES NOMINAL IN |
| MOUNTING CONFIGURATION | SIX 0.187 IN. DIA MTG HOLES,TWO ROWS OF 3 EA,0.450 IN. BETWEEN ROWS,5.125 IN. C TO C WITHIN ROWS IN |
| NSN | 5996-00-007-1375 |
| OVERALL HEIGHT | 0.787 INCHES NOMINAL IN |
| OVERALL LENGTH | 10.937 INCHES NOMINAL IN |
| OVERALL WIDTH | 5.000 INCHES NOMINAL IN |
| SPECIAL FEATURES | MOUNTING METHOD: HOLES FOR SCREWS; MAJOR COMPONENTS: CAPACITOR, DIODE, HEATSINK, INSULATOR, PRINTED WIRING BOARD, RESISTOR, TRANSISTOR; COMPONENT QUANTITY: 129 |
| MOUNTING CONFIGURATION | SIX 0.187 IN. DIA MTG HOLES,TWO ROWS OF 3 EA,0.450 IN. BETWEEN ROWS,5.125 IN. C TO C WITHIN ROWS IN |
No substitute or cross-reference records for this part.