The NETWORK,IMPEDANCE MATCHING is a the manufacturer industrial component. Key specifications include overall_height: 0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN, overall_diameter: 0.335 INCHES MINIMUM AND 0.370 INCHES MAXIMUM IN, special_features: JUNCTION PATTERN ARRANGEMENT: NPN, features_provided: HERMETICALLY SEALED CASE, internal_configuration: POINT CONTACT, semiconductor_material: SILICON. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5961-01-035-6678, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| overall_height | 0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN |
| overall_diameter | 0.335 INCHES MINIMUM AND 0.370 INCHES MAXIMUM IN |
| special_features | JUNCTION PATTERN ARRANGEMENT: NPN |
| features_provided | HERMETICALLY SEALED CASE |
| internal_configuration | POINT CONTACT |
| semiconductor_material | SILICON |
| terminal_type_and_quantity | 3 UNINSULATED WIRE LEAD |
| NSN | 5961-01-035-6678 |
| INTERNAL CONFIGURATION | POINT CONTACT |
| OVERALL HEIGHT | 0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN |
| FEATURES PROVIDED | HERMETICALLY SEALED CASE |
| TERMINAL TYPE AND QUANTITY | 3 UNINSULATED WIRE LEAD |
| SPECIAL FEATURES | JUNCTION PATTERN ARRANGEMENT: NPN |
| SEMICONDUCTOR MATERIAL | SILICON |
| OVERALL DIAMETER | 0.335 INCHES MINIMUM AND 0.370 INCHES MAXIMUM IN |