Name: MICROCIRCUIT,MEMORY
Brand: Unknown
SKU: 1536AS212-4

1536AS212-4 ✓ Verified by PartsTable

— · COMPONENT

WHAT YOU NEED TO KNOW

Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel

Confirm exact part number — similar PNs may be different parts

PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.610 INCHES MAXIMUM IN, body_height: 0.210 INCHES MAXIMUM IN, body_length: 1.290 INCHES MAXIMUM IN, features_provided: MONOLITHIC AND BIPOLAR AND PROGRAMMABLE, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-329-4468, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

1536AS212-4

NSN: 5962-01-329-4468
FSC: 5962
CAGE: 02387 — NAVAL AIR WARFARE CENTER AIRCRAFT DIV (USA)

SPECIFICATIONS

body_width	0.610 INCHES MAXIMUM IN
body_height	0.210 INCHES MAXIMUM IN
body_length	1.290 INCHES MAXIMUM IN
features_provided	MONOLITHIC AND BIPOLAR AND PROGRAMMABLE
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	ROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	11 INPUT
inclosure_configuration	DUAL-IN-LINE
NSN	5962-01-329-4468

COMPONENT DIAGRAM

KEY FEATURES

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MAXIMUM POWER DISSIPATION RATING: 1.0 WATTS

•

TERMINAL SURFACE TREATMENT: SOLDER

•

TEST DATA DOCUMENT: 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).

•

TERMINAL TYPE AND QUANTITY: 24 PRINTED CIRCUIT

•

VOLTAGE RATING AND TYPE PER CHARACTERISTIC: -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE

•

TIME RATING PER CHACTERISTIC: 100.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 100.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS

•

CASE OUTLINE SOURCE AND DESIGNATOR: D-3 MIL-M-38510

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS (FLIS)

INCLOSURE CONFIGURATION	DUAL-IN-LINE
MAXIMUM POWER DISSIPATION RATING	1.0 WATTS
TERMINAL SURFACE TREATMENT	SOLDER
TEST DATA DOCUMENT	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
TERMINAL TYPE AND QUANTITY	24 PRINTED CIRCUIT
VOLTAGE RATING AND TYPE PER CHARACTERISTIC	-0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE
TIME RATING PER CHACTERISTIC	100.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 100.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS
CASE OUTLINE SOURCE AND DESIGNATOR	D-3 MIL-M-38510
MEMORY DEVICE TYPE	ROM
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC

VERIFIED SUBSTITUTES & CROSS-REFERENCES 20

6657345-3Interchangeable