The SEMICONDUCTOR DEVICE,DIODE is a the manufacturer industrial component. Key specifications include material: GERMANIUM SEMICONDUCTOR, body_height: 0.718 INCHES NOMINAL IN, body_diameter: 0.500 INCHES NOMINAL IN, inclosure_type: ENCAPSULATED, overall_length: 0.100 INCHES MAXIMUM IN, mounting_method: TERMINAL. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 6160-00-081-7825, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| material | GERMANIUM SEMICONDUCTOR |
| body_height | 0.718 INCHES NOMINAL IN |
| body_diameter | 0.500 INCHES NOMINAL IN |
| inclosure_type | ENCAPSULATED |
| overall_length | 0.100 INCHES MAXIMUM IN |
| mounting_method | TERMINAL |
| terminal_length | 1.000 INCHES MINIMUM IN |
| overall_diameter | 0.110 INCHES MAXIMUM IN |
| special_features | WEAPON SYSTEM ESSENTIAL |
| style_designator | SEALED OR COATED BEAD |
| features_provided | HERMETICALLY SEALED CASE |
| surface_treatment | PASSIVATE |
| NSN | 6160-00-081-7825 |
| BODY DIAMETER | 0.500 INCHES NOMINAL IN |
| SURFACE TREATMENT | PASSIVATE |
| MATERIAL | STEEL |
| BODY HEIGHT | 0.718 INCHES NOMINAL IN |
| FSC APPLICATION DATA | BATTERY,STORAGE |
| MOUNTING CONFIGURATION | MTS BY 1/4 /0.250/ IN. -28 MTG THD 0.187 IN. LG IN |