151471-13 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

151471-13: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.245 INCHES MINIMUM AND 0.275 INCHES MAXIMUM IN, body_height: 0.050 INCHES MINIMUM AND 0.080 INCHES MAXIMUM IN, body_length: 0.370 INCHES MINIMUM AND 0.395 INCHES MAXIMUM IN, features_provided: MONOLITHIC, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC AND GLASS. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-100-7497, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

151471-13

NSN: 5962-01-100-7497
FSC: 5962 — Microcircuits, Electronic
CAGE: 35351 — GE AVIATION SYSTEMS LLC (USA)

SPECIFICATIONS

body_width	0.245 INCHES MINIMUM AND 0.275 INCHES MAXIMUM IN
body_height	0.050 INCHES MINIMUM AND 0.080 INCHES MAXIMUM IN
body_length	0.370 INCHES MINIMUM AND 0.395 INCHES MAXIMUM IN
features_provided	MONOLITHIC
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC AND GLASS
memory_device_type	ROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	6 INPUT
inclosure_configuration	FLAT PACK
terminal_surface_treatment	SOLDER
NSN	5962-01-100-7497

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 6 INPUT

•

INCLOSURE MATERIAL: CERAMIC AND GLASS

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.245 INCHES MINIMUM AND 0.275 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.050 INCHES MINIMUM AND 0.080 INCHES MAXIMUM IN

•

FEATURES PROVIDED: MONOLITHIC

•

INCLOSURE CONFIGURATION: FLAT PACK

•

MEMORY DEVICE TYPE: ROM

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	6 INPUT
INCLOSURE MATERIAL	CERAMIC AND GLASS
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.245 INCHES MINIMUM AND 0.275 INCHES MAXIMUM IN
BODY HEIGHT	0.050 INCHES MINIMUM AND 0.080 INCHES MAXIMUM IN
FEATURES PROVIDED	MONOLITHIC
INCLOSURE CONFIGURATION	FLAT PACK
MEMORY DEVICE TYPE	ROM
BODY LENGTH	0.370 INCHES MINIMUM AND 0.395 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC

SUBSTITUTES & CROSS-REFERENCES 3

S8224RReference document

Same NSN cross-reference

Reference document — Secondary reference

CC465WReference document

Same NSN cross-reference

Reference document — Secondary reference

A4L903451XReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is 151471-13?

151471-13 is a MICROCIRCUIT,MEMORY.

What parts can replace 151471-13?

There are 3 known substitutes for 151471-13: S8224R, CC465W, A4L903451X. Substitute compatibility should be verified for your specific system.

What is the NSN for 151471-13?

151471-13 is cataloged in the U.S. Government catalog under NSN 5962-01-100-7497. This indicates validated use in U.S. government and defense supply chains.

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