1513271-2 — SEMICONDUCTOR DEVICE,DIODE

✓ Government record, cited

— · SFP TRANSCEIVER

PRODUCT OVERVIEW

1513271-2: SEMICONDUCTOR DEVICE,DIODE.

The SEMICONDUCTOR DEVICE,DIODE is a the manufacturer industrial component. Key specifications include material: GLASS ENCLOSURE, overall_length: 0.840 INCHES MAXIMUM IN, mounting_method: PRESS FIT, overall_diameter: 0.250 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED CASE, terminal_type_and_quantity: 2 UNINSULATED WIRE LEAD. This part is cataloged in the U.S.

Government catalog under NSN 5961-00-045-3146, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

1513271-2

NSN: 5961-00-045-3146
FSC: 5961 — Semiconductor Devices and Associated Hardware
CAGE: 05869 — RAYTHEON COMPANY DIV RMD STRATEGIC (USA)

SPECIFICATIONS

material	GLASS ENCLOSURE
overall_length	0.840 INCHES MAXIMUM IN
mounting_method	PRESS FIT
overall_diameter	0.250 INCHES MAXIMUM IN
features_provided	HERMETICALLY SEALED CASE
terminal_type_and_quantity	2 UNINSULATED WIRE LEAD
power_rating_per_characteristic	500.0 MILLIWATTS MINIMUM TOTAL POWER DISSIPATION
voltage_rating_in_volts_per_characteristic	-15.0 MAXIMUM BREAKDOWN VOLTAGE, DC
maximum_operating_temp_per_measurement_point	75.0 CELSIUS AMBIENT AIR DEGC
NSN	5961-00-045-3146

COMPONENT DIAGRAM

KEY FEATURES

•

VOLTAGE RATING IN VOLTS PER CHARACTERISTIC: -15.0 MAXIMUM BREAKDOWN VOLTAGE, DC

•

MAXIMUM OPERATING TEMP PER MEASUREMENT POINT: 75.0 CELSIUS AMBIENT AIR DEGC

•

OVERALL DIAMETER: 0.250 INCHES MAXIMUM IN

•

MOUNTING METHOD: PRESS FIT

•

FEATURES PROVIDED: HERMETICALLY SEALED CASE

•

MATERIAL: SILICON SEMICONDUCTOR

TECHNICAL CHARACTERISTICS

VOLTAGE RATING IN VOLTS PER CHARACTERISTIC	-15.0 MAXIMUM BREAKDOWN VOLTAGE, DC
MAXIMUM OPERATING TEMP PER MEASUREMENT POINT	75.0 CELSIUS AMBIENT AIR DEGC
OVERALL DIAMETER	0.250 INCHES MAXIMUM IN
MOUNTING METHOD	PRESS FIT
OVERALL LENGTH	0.840 INCHES MAXIMUM IN
FEATURES PROVIDED	HERMETICALLY SEALED CASE
MATERIAL	SILICON SEMICONDUCTOR
MATERIAL	GLASS ENCLOSURE
TERMINAL TYPE AND QUANTITY	2 UNINSULATED WIRE LEAD
POWER RATING PER CHARACTERISTIC	500.0 MILLIWATTS MINIMUM TOTAL POWER DISSIPATION

OTHER ITEMS IN FSC 5961 — Semiconductor Devices and Associated Hardware

Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.

5961-00-000-0150 5961-00-000-4541 5961-00-000-5400 5961-00-000-7614 5961-00-000-8760 5961-00-001-1352 5961-00-001-2624 5961-00-001-2978

SUBSTITUTES & CROSS-REFERENCES

No substitute or cross-reference records for this part.

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Terminal item — stock exhausted; no further procurementNo demilitarization required

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FREQUENTLY ASKED QUESTIONS

What is 1513271-2?

1513271-2 is a SEMICONDUCTOR DEVICE,DIODE.

What is the NSN for 1513271-2?

1513271-2 is cataloged in the U.S. Government catalog under NSN 5961-00-045-3146. This indicates validated use in U.S. government and defense supply chains.

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1513271-2 — SEMICONDUCTOR DEVICE,DIODE

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