15-511814-1 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

15-511814-1: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.600 INCHES MAXIMUM IN, body_height: 0.205 INCHES NOMINAL IN, body_length: 1.290 INCHES MAXIMUM IN, overall_height: 0.345 INCHES NOMINAL IN, features_provided: ULTRAVIOLET ERASABLE AND PROGRAMMABLE AND 3-STATE OUTPUT AND HIGH IMPEDANCE AND LOW POWER, output_logic_form: N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-296-3070, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

15-511814-1

NSN: 5962-01-296-3070
NIINs: 012963070, 012963071, 012963577, 012965452
FSC: 5962 — Microcircuits, Electronic
CAGE: 04655 — GENERAL DYNAMICS MISSION SYSTEMS, INC. (USA)

SPECIFICATIONS

body_width	0.600 INCHES MAXIMUM IN
body_height	0.205 INCHES NOMINAL IN
body_length	1.290 INCHES MAXIMUM IN
overall_height	0.345 INCHES NOMINAL IN
features_provided	ULTRAVIOLET ERASABLE AND PROGRAMMABLE AND 3-STATE OUTPUT AND HIGH IMPEDANCE AND LOW POWER
output_logic_form	N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	ROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	11 INPUT
NSN	5962-01-296-3070

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 11 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.600 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.205 INCHES NOMINAL IN

•

FEATURES PROVIDED: ULTRAVIOLET ERASABLE AND PROGRAMMABLE AND 3-STATE OUTPUT AND HIGH IMPEDANCE AND LOW POWER

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

OVERALL HEIGHT	0.345 INCHES NOMINAL IN
INPUT CIRCUIT PATTERN	11 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.600 INCHES MAXIMUM IN
BODY HEIGHT	0.205 INCHES NOMINAL IN
FEATURES PROVIDED	ULTRAVIOLET ERASABLE AND PROGRAMMABLE AND 3-STATE OUTPUT AND HIGH IMPEDANCE AND LOW POWER
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	ROM
BODY LENGTH	1.290 INCHES MAXIMUM IN

SUBSTITUTES & CROSS-REFERENCES 1

ROM/PROMReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is 15-511814-1?

15-511814-1 is a MICROCIRCUIT,MEMORY.

What parts can replace 15-511814-1?

There is 1 known substitute for 15-511814-1: ROM/PROM. Substitute compatibility should be verified for your specific system.

What is the NSN for 15-511814-1?

15-511814-1 is cataloged in the U.S. Government catalog under NSN 5962-01-296-3070. This indicates validated use in U.S. government and defense supply chains.

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15-511814-1 — MICROCIRCUIT,MEMORY

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