15-2726661-002: MICROCIRCUIT,MEMORY.
The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN, body_height: 0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN, body_length: 0.840 INCHES MAXIMUM IN, features_provided: PROGRAMMED AND SCHOTTKY AND BIPOLAR, inclosure_material: CERAMIC, memory_device_type: PROM. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-290-6597, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN |
| body_height | 0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN |
| body_length | 0.840 INCHES MAXIMUM IN |
| features_provided | PROGRAMMED AND SCHOTTKY AND BIPOLAR |
| inclosure_material | CERAMIC |
| memory_device_type | PROM |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| inclosure_configuration | DUAL-IN-LINE |
| terminal_surface_treatment | SOLDER |
| current_rating_per_characteristic | 130.00 MILLIAMPERES MAXIMUM SUPPLY |
| voltage_rating_and_type_per_characteristic | -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
| NSN | 5962-01-290-6597 |
| INCLOSURE MATERIAL | CERAMIC |
| TERMINAL SURFACE TREATMENT | SOLDER |
| BODY WIDTH | 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN |
| BODY HEIGHT | 0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN |
| FEATURES PROVIDED | PROGRAMMED AND SCHOTTKY AND BIPOLAR |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CURRENT RATING PER CHARACTERISTIC | 130.00 MILLIAMPERES MAXIMUM SUPPLY |
| MEMORY DEVICE TYPE | PROM |
| BODY LENGTH | 0.840 INCHES MAXIMUM IN |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS DEGC |