15-1326285-1 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

15-1326285-1: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include memory_capacity: 128KX8, special_features: CBBL, features_provided: RADIATION HARDENED AND ELECTROSTATIC SENSITIVE, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC, memory_device_type: RAM. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-372-1262, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

15-1326285-1

NSN: 5962-01-372-1262
FSC: 5962 — Microcircuits, Electronic
CAGE: 04655 — GENERAL DYNAMICS MISSION SYSTEMS, INC. (USA)

SPECIFICATIONS

memory_capacity	128KX8
special_features	CBBL
features_provided	RADIATION HARDENED AND ELECTROSTATIC SENSITIVE
output_logic_form	COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	RAM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
hybrid_technology_type	MONOLITHIC
end_item_identification	HAC/RMPE REAC E/I FSCM 11293
inclosure_configuration	LEADED CHIP CARRIER
terminal_surface_treatment	SOLDER
NSN	5962-01-372-1262

COMPONENT DIAGRAM

KEY FEATURES

•

HYBRID TECHNOLOGY TYPE: MONOLITHIC

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

CRITICALITY CODE JUSTIFICATION: FEAT

•

FEATURES PROVIDED: RADIATION HARDENED AND ELECTROSTATIC SENSITIVE

•

INCLOSURE CONFIGURATION: LEADED CHIP CARRIER

•

PURCHASE DESCRIPTION IDENTIFICATION: 11293-15-1326285-1

•

MEMORY DEVICE TYPE: RAM

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

HYBRID TECHNOLOGY TYPE	MONOLITHIC
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
CRITICALITY CODE JUSTIFICATION	FEAT
FEATURES PROVIDED	RADIATION HARDENED AND ELECTROSTATIC SENSITIVE
INCLOSURE CONFIGURATION	LEADED CHIP CARRIER
PURCHASE DESCRIPTION IDENTIFICATION	11293-15-1326285-1
MEMORY DEVICE TYPE	RAM
DEPARTURE FROM CITED DESIGNATOR	MODIFIED FOR NUCLEAR HARDNESS IMPACT
CASE OUTLINE SOURCE AND DESIGNATOR	C-11 MIL-M-38510

SUBSTITUTES & CROSS-REFERENCES 2

5962-8866203NAReference document

Same NSN cross-reference

Reference document — Secondary reference

NH15-1326285-1Reference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Terminal item — no further procurement; issued until stock is exhaustedDemilitarization required — mutilation + specific procedure

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FREQUENTLY ASKED QUESTIONS

What is 15-1326285-1?

15-1326285-1 is a MICROCIRCUIT,MEMORY.

What parts can replace 15-1326285-1?

There are 2 known substitutes for 15-1326285-1: 5962-8866203NA, NH15-1326285-1. Substitute compatibility should be verified for your specific system.

What is the NSN for 15-1326285-1?

15-1326285-1 is cataloged in the U.S. Government catalog under NSN 5962-01-372-1262. This indicates validated use in U.S. government and defense supply chains.

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