145A368-3 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

145A368-3: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include features_provided: BURN IN AND ELECTROSTATIC SENSITIVE AND BIPOLAR AND MONOLITHIC AND PROGRAMMED, inclosure_material: CERAMIC, memory_device_type: PAL, storage_temp_range: -65.0 TO 150.0 CELSIUS DEGC, test_data_document: 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.)., operating_temp_range: -55.0 TO 125.0 CELSIUS DEGC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-362-7012, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

145A368-3

NSN: 5962-01-362-7012
FSC: 5962 — Microcircuits, Electronic
CAGE: 03640 — LOCKHEED MARTIN CORPORATION DIV ROTARY AND MISSION SYSTEMS (USA)

SPECIFICATIONS

features_provided	BURN IN AND ELECTROSTATIC SENSITIVE AND BIPOLAR AND MONOLITHIC AND PROGRAMMED
inclosure_material	CERAMIC
memory_device_type	PAL
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	16 INPUT
inclosure_configuration	FLAT PACK
terminal_surface_treatment	SOLDER
terminal_type_and_quantity	20 FLAT LEADS
maximum_power_dissipation_rating	1.1 WATTS
case_outline_source_and_designator	F-9 MIL-M-38510
NSN	5962-01-362-7012

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 16 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

FEATURES PROVIDED: BURN IN AND ELECTROSTATIC SENSITIVE AND BIPOLAR AND MONOLITHIC AND PROGRAMMED

•

INCLOSURE CONFIGURATION: FLAT PACK

•

MEMORY DEVICE TYPE: PAL

•

CASE OUTLINE SOURCE AND DESIGNATOR: F-9 MIL-M-38510

•

STORAGE TEMP RANGE: -65.0 TO 150.0 CELSIUS DEGC

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	16 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
FEATURES PROVIDED	BURN IN AND ELECTROSTATIC SENSITIVE AND BIPOLAR AND MONOLITHIC AND PROGRAMMED
INCLOSURE CONFIGURATION	FLAT PACK
MEMORY DEVICE TYPE	PAL
CASE OUTLINE SOURCE AND DESIGNATOR	F-9 MIL-M-38510
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC
VOLTAGE RATING AND TYPE PER CHARACTERISTIC	7.0 VOLTS MAXIMUM POWER SOURCE
OPERATING TEMP RANGE	-55.0 TO 125.0 CELSIUS DEGC

SUBSTITUTES & CROSS-REFERENCES 2

5962-8515508SAReference document

Same NSN cross-reference

Reference document — Secondary reference

ROM/PROMReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation + specific procedure

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FREQUENTLY ASKED QUESTIONS

What is 145A368-3?

145A368-3 is a MICROCIRCUIT,MEMORY.

What parts can replace 145A368-3?

There are 2 known substitutes for 145A368-3: 5962-8515508SA, ROM/PROM. Substitute compatibility should be verified for your specific system.

What is the NSN for 145A368-3?

145A368-3 is cataloged in the U.S. Government catalog under NSN 5962-01-362-7012. This indicates validated use in U.S. government and defense supply chains.

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