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Technical Data Sheet
144556-003 ✓ Verified by PartsTable
· COMPONENT
WHAT YOU NEED TO KNOW
Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel
Confirm exact part number — similar PNs may be different parts
PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN, body_height: 0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN, body_length: 0.840 INCHES MAXIMUM IN, memory_capacity: UNKNOWN, features_provided: HERMETICALLY SEALED AND MONOLITHIC AND PROGRAMMABLE AND PROGRAMMED AND 3-STATE OUTPUT, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC. This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-122-1995, indicating validated use in U.S.

government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels. Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
144556-003
NSN: 5962-01-122-1995
FSC: 5962
CAGE: 91417 — L3HARRIS TECHNOLOGIES, INC. (USA)
SPECIFICATIONS
body_width0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
body_height0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN
body_length0.840 INCHES MAXIMUM IN
memory_capacityUNKNOWN
features_providedHERMETICALLY SEALED AND MONOLITHIC AND PROGRAMMABLE AND PROGRAMMED AND 3-STATE OUTPUT
output_logic_formTRANSISTOR-TRANSISTOR LOGIC
inclosure_materialCERAMIC
memory_device_typePROM
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern6 INPUT
end_item_identificationHULL OBRP 03950
NSN5962-01-122-1995
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN 144556-003 MFR MICROCIRCUIT,MEMORY
KEY FEATURES
FEATURES PROVIDED: HERMETICALLY SEALED AND MONOLITHIC AND PROGRAMMABLE AND PROGRAMMED AND 3-STATE OUTPUT
INCLOSURE MATERIAL: CERAMIC
OPERATING TEMP RANGE: -55.0 TO 125.0 CELSIUS DEGC
TIME RATING PER CHACTERISTIC: 80.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 80.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS
TERMINAL TYPE AND QUANTITY: 16 PRINTED CIRCUIT
TERMINAL SURFACE TREATMENT: SOLDER
SPECIFICATION/STANDARD DATA: 81349-MIL-M-38510/207/USAF/ GOVERNMENT SPECIFICATION
MEMORY DEVICE TYPE: PROM
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS (FLIS)
FEATURES PROVIDEDHERMETICALLY SEALED AND MONOLITHIC AND PROGRAMMABLE AND PROGRAMMED AND 3-STATE OUTPUT
INCLOSURE MATERIALCERAMIC
OPERATING TEMP RANGE-55.0 TO 125.0 CELSIUS DEGC
TIME RATING PER CHACTERISTIC80.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 80.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS
TERMINAL TYPE AND QUANTITY16 PRINTED CIRCUIT
TERMINAL SURFACE TREATMENTSOLDER
SPECIFICATION/STANDARD DATA81349-MIL-M-38510/207/USAF/ GOVERNMENT SPECIFICATION
MEMORY DEVICE TYPEPROM
MEMORY CAPACITYUNKNOWN
TEST DATA DOCUMENT81349-MIL-M-38510 SPECIFICATION (INCLUDES ENGINEERING TYPE BULLETINS, BROCHURES,ETC., THAT REFLECT SPECIFICATION TYPE DATA IN SPECIFICATION FORMAT; EXCLUDES COMMERCIAL CATALOGS, INDUSTRY DIRECTORIES, AND SIMILAR TRADE PUBLICATIONS, REFLECTING GENERAL TYPE DATA ON CERTAIN ENVIRONMENTAL AND PERFORMANCE REQUIREMENTS AND TEST CONDITIONS THAT ARE SHOWN AS "TYPICAL", "AVERAGE", "NOMINAL", ETC.).
VERIFIED SUBSTITUTES & CROSS-REFERENCES 26
54S288Interchangeable
interchangeable cross-reference
interchangeable
ROM/PROM HEAD 022Interchangeable
interchangeable cross-reference
interchangeable
HPR0M8256Interchangeable
interchangeable cross-reference
interchangeable
M38510/20702BEBInterchangeable
interchangeable cross-reference
interchangeable
5962-3820702BEBInterchangeable
interchangeable cross-reference
interchangeable
ROM/PROM FAMILY 013Interchangeable
interchangeable cross-reference
interchangeable
LIFECYCLE
StatusCANCELLED
Availability
RoHS CompliantEAR99ESD SensitiveNot HAZMAT
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FREQUENTLY ASKED QUESTIONS
What is 144556-003?
144556-003 is a MICROCIRCUIT,MEMORY.
What parts can replace 144556-003?
There are 26 known substitutes for 144556-003: 54S288, ROM/PROM HEAD 022, HPR0M8256 and 23 more. Substitute compatibility should be verified for your specific system.
Is 144556-003 still available?
144556-003 is currently cancelled.
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