143503398 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

143503398: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.520 INCHES MAXIMUM IN, body_height: 0.205 INCHES MAXIMUM IN, body_length: 1.300 INCHES MAXIMUM IN, features_provided: LOW POWER AND HIGH SPEED AND W/ENABLE, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: PLASTIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-293-6609, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

143503398

NSN: 5962-01-293-6609
FSC: 5962 — Microcircuits, Electronic
CAGE: 31795 — EATON CORPORATION (USA)

SPECIFICATIONS

body_width	0.520 INCHES MAXIMUM IN
body_height	0.205 INCHES MAXIMUM IN
body_length	1.300 INCHES MAXIMUM IN
features_provided	LOW POWER AND HIGH SPEED AND W/ENABLE
output_logic_form	COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	PLASTIC
memory_device_type	RAM
storage_temp_range	-55.0 TO 125.0 CELSIUS DEGC
operating_temp_range	-40.0 TO 85.0 CELSIUS DEGC
input_circuit_pattern	21 INPUT
inclosure_configuration	DUAL-IN-LINE
terminal_surface_treatment	SOLDER
NSN	5962-01-293-6609

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 21 INPUT

•

INCLOSURE MATERIAL: PLASTIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.520 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.205 INCHES MAXIMUM IN

•

FEATURES PROVIDED: LOW POWER AND HIGH SPEED AND W/ENABLE

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: RAM

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	21 INPUT
INCLOSURE MATERIAL	PLASTIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.520 INCHES MAXIMUM IN
BODY HEIGHT	0.205 INCHES MAXIMUM IN
FEATURES PROVIDED	LOW POWER AND HIGH SPEED AND W/ENABLE
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	RAM
BODY LENGTH	1.300 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-55.0 TO 125.0 CELSIUS DEGC

SUBSTITUTES & CROSS-REFERENCES 3

HM6116LP-4Reference document

Same NSN cross-reference

Reference document — Advisory reference — outside the item-of-supply concept

PD446C-2Reference document

Same NSN cross-reference

Reference document — Secondary reference

MB8416A-12PReference document

Same NSN cross-reference

Reference document — Advisory reference — outside the item-of-supply concept

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is 143503398?

143503398 is a MICROCIRCUIT,MEMORY.

What parts can replace 143503398?

There are 3 known substitutes for 143503398: HM6116LP-4, PD446C-2, MB8416A-12P. Substitute compatibility should be verified for your specific system.

What is the NSN for 143503398?

143503398 is cataloged in the U.S. Government catalog under NSN 5962-01-293-6609. This indicates validated use in U.S. government and defense supply chains.

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143503398 — MICROCIRCUIT,MEMORY

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