142392-0001: MICROCIRCUIT,MEMORY.
The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN, body_height: 0.105 INCHES MINIMUM AND 0.180 INCHES MAXIMUM IN, body_length: 0.745 INCHES MINIMUM AND 0.785 INCHES MAXIMUM IN, memory_capacity: UNKNOWN, features_provided: HERMETICALLY SEALED AND SYNCHRONOUS AND EXPANDABLE AND LOW POWER AND 3-STATE OUTPUT, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-116-8673, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN |
| body_height | 0.105 INCHES MINIMUM AND 0.180 INCHES MAXIMUM IN |
| body_length | 0.745 INCHES MINIMUM AND 0.785 INCHES MAXIMUM IN |
| memory_capacity | UNKNOWN |
| features_provided | HERMETICALLY SEALED AND SYNCHRONOUS AND EXPANDABLE AND LOW POWER AND 3-STATE OUTPUT |
| output_logic_form | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| inclosure_material | CERAMIC |
| memory_device_type | FIRST-IN FIRST-OUT |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| test_data_document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | 7 INPUT |
| NSN | 5962-01-116-8673 |
| INPUT CIRCUIT PATTERN | 7 INPUT |
| INCLOSURE MATERIAL | CERAMIC |
| TERMINAL SURFACE TREATMENT | SOLDER |
| BODY WIDTH | 0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN |
| BODY HEIGHT | 0.105 INCHES MINIMUM AND 0.180 INCHES MAXIMUM IN |
| FEATURES PROVIDED | HERMETICALLY SEALED AND SYNCHRONOUS AND EXPANDABLE AND LOW POWER AND 3-STATE OUTPUT |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| MEMORY DEVICE TYPE | FIRST-IN FIRST-OUT |
| CASE OUTLINE SOURCE AND DESIGNATOR | MO-001-AC JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
| BODY LENGTH | 0.745 INCHES MINIMUM AND 0.785 INCHES MAXIMUM IN |